Curing Process Simulation Of Fiber Optic Cable Package

The fiber winding package of fiber-optic guided missile is an important functional part of it.To ensure that the wire package does not collapse during storage and transportation and the optical fiber can be released smoothly during the flight of the missile is the basic requirement of the wire package manufacturing.Therefore,adhesive is coated in the optical fiber winding process and high temperature curing process is carried out.However,due to the high temperature and the curing reaction of the binder in the curing process,the uneven residual stress appears in the wire package,which leads to the stress concentration and even defects in the wire package,leaving a hidden danger for the missile launch.In order to solve the above problems,this paper based on the theory of meso-mechanics to simulate the wire bale curing process,and based on the secondary development technology of ANSYS software to build a parametric simulation platform of the wire package curing process.The physical and chemical changes of optical fiber and binder in the process of wire cladding curing were analyzed,and the structure of the wire package was analyzed.Based on the theory of micromechanics,the heat conduction model,the curing kinetics model,the residual stress and strain model of wire cladding curing and the micro mechanical model of wire cladding material were established.The thermal conduction model of the wire package and the curing kinetics model of the adhesive in the curing process are coupled to solve,and the temperature field and the curing degree field distribution and the time history of the change during the curing process of the wire package are obtained.With reference to the maximum temperature difference and curing degree difference of the package during the curing process,the effects of curing temperature,heating rate and convective heat transfer coefficient on the curing uniformity of the package are studied.On the basis of solving the heat conduction model and curing kinetics model,the results of temperature and curing degree are transferred to the solution of curing deformation model,the residual stress and strain distribution after curing is obtained,and the reasons for the formation of curing strain and residual stress distribution are analyzed.The effects of curing temperature,cooling rate,and number of fiber winding layers on the curing deformation of the wire package are studied.Based on the ANSYS parameter design language APDL and its batch processing mode,the parametric simulation of the optical fiber package curing process is realized.In the Visual C++environment,the parametric simulation process is encapsulated using MFC variable programming,and the parametric simulation software of the wire package curing process is developed.Through the numerical simulation of the wire package curing process,the distribution of the residual stress strain of the wire package curing and the influence of the curing process parameters on the uniformity and curing deformation of the wire package curing process are studied,which provides a theoretical reference for the selection and optimization of the curing process.Developed the parametric simulation software of the wire package curing process,which provides simulation means for the design and optimization of the serialized wire package curing process.