Analysis Of Single Layer Microchannel Heat Sink Heat Transfer Performance

In the last decades,intensive attention was paid on miniaturizing the electronic devices because of the high sophisticated micro and Nano-technology development that has occurred.But the heat dissipation is still a major problem of the enhancement of thermal performance the heat sinks.Because of this,many studies have been taken up for the enhancement of convective heat transfer and thus improving the performance of a micro channel heat sink.In order to improve heat transfer and fluid flow,many designs have been proposed and analyzed.Designs of double layered microchannels,microchannels with solid fins or porous fins,those with wavy fins or wavy and porous fins have all been studies in different aspects and angles.In this work,a study of the effects of introducing porous fins into the single layer microchannel heat sink of different designs is done.The single layer microchannel heat sink,the single layer microchannel with parrallel fins and the single layer microchannel with symetric fins are observed and simulated using the commercial software CFD ANSYS.The effects of the porous fins on the different structures under different inlet velocities are looked at.The study also looks into the effect of introducing different gap width of 100W,300W and 500W into the geometry design and monitor the effect of this on the heat sinks.From the results obtained,it is observed that because the permeability in porous fins is increased,this improves both fluid flow and heat transfer performances of the heat sink.In the high pumping power region,results show that the solid rib channels designs achieve higher thermal resistances compared to the porous channels designs.The PEF value of the solid fin heat sink is found lower than that of the porous heat sinks,which shows that the solid fin heat sink’s thermal efficiency is inferior to that of a porous fin heat sink when under the same pumping power consumption.With the development of highly integrated and miniature electronic technology,the thermal management of electronic devices is very important so as to prevent the devices from overheating while at the same time maintaining reliable and normal operating performances.Which is why it is important to keep perfecting the heat sink design.