Research On Heat Transfer Characteristics Of Electronic Radiator Filled With Metal Foam

In today’s world,the electronics industry is developing with each passing day.People are paying great attention to their own heat dissipation performance while pursuing highperformance,micro-electronics,and integrated electronic devices.Among many functional materials,porous materials stand out through their own special structure,such as high specific surface area,high mechanical strength,low density,and high porosity.They are regarded as compact heat exchangers and high-power electronics in aviation equipment.One of the main heat dissipation materials of the equipment.Therefore,how to reasonably optimize the heat dissipation device of the electronic equipment,improve the internal flow field of the electronic equipment,thereby effectively reduce the temperature of the key components,and improve the stability and practical life of the electronic equipment has become an important issue.In this paper,a test bench for the performance of a metal foam-filled radiator is used to test the heat transfer performance of an electronic radiator filled with copper foam with a porosity of 96% and a pore density of 20 PPI and 10 PPI,and aluminum foam with 10 PPI.Conducted experimental research.Compare the heat dissipation performance of electronic heat sink devices with different flow rates,different pore densities,and different numbers of fins under the same porosity.Research indicates:(1)After the electronic fin radiator is filled with foamed metal,compared with the unfilled metal foamed electronic fin radiator,the heat taken away by the fluid increases significantly,and the heat dissipation is larger;as the fluid flow rate continues to increase,the heat exchange of electronic radiators is also increasing.(2)Within the scope of the provisions of traffic(10 L/h ～ 60 L/h),with the increasing of fluid flow,not filled with foam metal and filled metal electronic radiator surface heat transfer coefficient is increased gradually,but filled with foam metal electronic radiator surface heat transfer coefficient is significantly higher than not filled with foam metal electronic radiator,the surface heat transfer coefficient increases first and then decreases with the number of fins,and the surface heat transfer coefficient is the highest when the number of fins is three.(3)Within the specified flow rate range,the friction coefficient of the electronic radiator decreases with the increase of the Reynolds number with or without metal foam filling.When Re > 3000,the decreasing trend of the friction coefficient gradually becomes slow.Moreover,the frictional resistance coefficient of the electronic radiator filled with metal foam is obviously larger than that of the electronic radiator without metal foam.(4)When 1000≤Re≤3000,the PEC value gradually increases with the increase of Reynolds number.However,in the foam metal electronic radiators filled with no fins and five fins,the PEC value is < 1,indicating that the heat dissipation capacity of electronic radiators is poor at this time.When 3000≤Re≤6000,the PEC gradually increases with the increase of Re,and the PEC value of the four types of fin filled metal electronic radiators is all greater than 1.