Research On Immersion Temperature Equalization System Of Electronic Equipment

With the rapid development of new and high-tech technologies such as the Internet,the Internet of Things,big data and artificial intelligence,the computing speed of chips is accelerating,the integration is getting higher and the size is getting smaller,which leads to a sharp increase in the heat flux of electronic devices.At the same time,the research progress of thermal design of electronic equipment lags behind slightly,which makes the situation of uneven temperature distribution and high energy consumption of electronic equipment can not be effectively improved,which seriously affects the normal work of electronic equipment.In this paper,based on the relevant theories of heat transfer and computational fluid dynamics,for the heat dissipation of electronic equipment under high heat flux,the immersive heat dissipation technology is used for the heat dissipation of electronic equipment,in order to achieve low energy consumption,high energy efficiency,strong heat dissipation capacity of electronic equipment temperature equalization system.Firstly,the design principle of the immersive temperature equalization system is described,and the temperature equalization system is divided into two parts: inner cycle and outer cycle.This paper introduces the components of the internal circulation system and the modularized heat dissipation method,analyzes the realization form of the external circulation system in different areas,and analyzes the heat transfer process of finned tube heat exchanger.Through the comparison and analysis of a variety of cooling medium,the fluorinated liquid FC-3283 is finally selected as the cooling medium of the temperature equalization system.Then,the structure of temperature equalization system is designed in the Solid Works,the fluent software is used to simulate the distribution of temperature field around electronic equipment and the flow state of cooling medium in the flow field nearby.The influence of different input flow rate and input flow rate of coolant and different arrangement of electronic equipment on the heat dissipation performance of temperature equalization system is studied.experimental instruments and equipment are selected,the immersive electronic equipment temperature equalization system experimental platform is built,the experimental scheme is designed,the measurement point layout,experimental conditions,experimental steps are described in detail,and the six conditions are carried out experiments.Finally,through the analysis of the simulation results and experimental data,it is concluded that increasing the flow rate and flow rate of coolant can accelerate the degree of fluid turbulence,which is conducive to improving the heat transfer efficiency.The vertical pendulum is better than the horizontal pendulum to place the electronic equipment,and the PUE under the six experimental conditions is all lower than 1.2.It is proved that the temperature equalization system of the immersive electronic equipment designed in this paper has better performance and significant energy saving effect compared with the traditional air forced convection cooling method.