Research On Natural Convection Heat Dissipation Optimization Of Electronic Component Radiator Fins

Recently,the electronics industry has shown an accelerating growth trend,and it is developing towards scale.The integration degree,packaging density,and operating frequency of electronic chips have continued to increase,which has led to a significant increase in the total power and heat generation per unit volume of electronic devices.The problem of heat dissipation has become one of the main obstacles limiting its development,and making it as one of the hot research topics.At present,the heat dissipation technology of the electronic communication industry is mainly based on natural convection heat dissipation,forced air cooling,liquid cooling and heat pipe heat dissipation,while the heat dissipation method of outdoor electronic equipment is subject to the requirements of the use environment and heat dissipation reliability,and most of them are convection heat transfer.The heat dissipation technology based on natural convection heat exchange has the advantages of stable performance,high safety,no noise,low manufacturing cost,etc.,and has been widely used in the field of heat dissipation of electronic circuit equipment,biological engineering buildings and solar energy.Aiming at the heat dissipation problem of outdoor electronic equipment,this paper designs and develops a new type of heat sink fin structure.While adding a vortex generator to the fin,a triangular hole is opened at the position corresponding to the vortex generator.It is easy to realize and avoids the problem of connecting the vortex generator to the fins of the radiator.Numerical simulation and experimental methods were used to study the heat dissipation effect of the structure.It was found that the new type of heat sink fin can effectively reduce the temperature of the heat source chip part,and the temperature gain on the fin surface is high at both ends and low at the middle.Through detailed numerical simulation,the effects of the distance and thickness of the straight fin fins on its heat dissipation performance were studied,and the optimal results were obtained by comparison.An open-hole eddy current generator was established based on the optimal size of the straight fins.The influence of the small wing space size and layout on the heat dissipation performance was obtained,and the optimization results were obtained.Simultaneously,the dimple size on the flow exchange was simulated.The effects of heat.It was found that arranging perforated winglets and small dimples on the fins could improve the heat dissipation of the fins themselves.Adjusting the position of the perforated winglets would change the temperature gain area of ??the fins;when the fins were placed vertically,the high-temperature boundary layer formed on the top would weaken the fins.The heat dissipation of the chip leads to local high temperature and even the failure of electronic components.This paper compares the effects of different types of spoiler structures on heat dissipation in high temperature areas through numerical simulations,and gives the best solution for heat dissipation in high temperature areas of fins.The flow and heat transfer of the structural scheme and the dimple structure scheme found that the distance between the open winglets is 40 mm,the height of the dimple is 3 mm at an angle of attack of 15 °,and the heat source area at the top of the fins is in the same structure with different arrangements when the pitch is 40 mm The heat dissipation effect is the best,and further comparison of the flow resistance of the two shows that the flow resistance of the open-wing wing solution with a pitch of 40 mm and an angle of attack of 15°is relatively small.