| Recently,the electronic equipment has become increasingly integrated,miniaturized,and high-powered since the development of electronic information technology and the continuous improvement of the overall manufacturing level,this also means that new challenges of thermal management of electronic devices has occurred.The working efficiency and stability of components will be directly affected when the surface temperature is too high.Sometimes it will also cause component performance degradation or even life cycle shortening.Therefore,the efficient heat dissipation of electronic products with high heat flux has gradually become the key for thermal design,and the forced liquid cooling technology has been widely used due to its compact structure and high heat exchange efficiency.However,design of traditional heat sink has no longer meet the heat dissipation requirements of high-power and high-heat-flow products because of its own limitation in the shape and structure.The topology optimization method has brought a new solution to the design of flow channel structure of the heat sink based on this situation.On this basis,this paper proposes a new type of staggered multi-inlet and multi-outlet topology optimization heat sink based on topology optimization technology of variable density method,and its flow and heat transfer performance under steady-state laminar flow is studied.At the same time,the new topology heat sink is verified by experiments.The specific work is as follows:Firstly,The interpolation method of variable density method is used to optimize the structure of the fluid design domain based on continuum structure topology optimization theory.Then the average temperature of the design domain and the root mean square of the temperature are set as the objective functions,and the penalty factor is also introduced.The different density values of unit design variable represent two different materials,fluid and solid.Then using the coupled fluid dissipation work to establish a multi-objective optimization mathematical model.Then after iterative evolution using the method of moving asymptotes optimization algorithm,The TM1 and TM2 two-dimensional channel configurations for different heat dissipation requirements are adaptively generated.Secondly,the fluid flow and heat transfer performance of the new TM1 uniform temperature topology model and the new TM2 temperature root-mean-square topology model is studied by CFD numerical simulation methods,and comparing with the traditional straight-through channel model under the same flow solid product ratio.The result has shown that under different Reynolds numbers(Re=800~2000),the new topology model has improvement over the traditional straight-through channel model in terms of the heat transfer effect.The TM1 topology model can effectively realize the uniform distribution of the average temperature of the bottom plate with the smallest temperature difference;the TM2 topology model can effectively reduce the hot spot area,and the highest temperature value in the heat sink is the lowest,and the average Nusselt number is the largest.Compared with the traditional straight-through heat,the new topology model has reduced the total thermal resistance by about 47% at the same flow rate,and the maximum drop in inlet and outlet pressure drops is 67%,and the flow resistance is reduced.Finally,the experimental platform of a new staggered multi-inlet and multi-outlet heat sink was built,and convective heat transfer experiments of TMI heat sink were conducted.Through the analysis of the experimental results,the relative error between the experimental average Nusselt number and the numerical simulation average Nusselt number of this sink at different inlet flow rates does not exceed 6.6%,and the relative error of the inlet and outlet pressure drop does not exceed 9.5%.Therefore,it has verified that the topology optimization and numerical method of this article are correct. |