| The large-scale application of high-density cabinets in data centers has led to increasing energy consumption.At present,the main development direction of data center cooling technology is to reduce data center thermal management energy consumption,increase the heat dissipation efficiency of high heat density cabinet and reduce the average PUE of data center.The traditional air-cooled heat dissipation method has low cooling density and can not effectively solve the heat dissipation problem of high heat density cabinet,while the technology of submerged liquid cooling heat dissipation method is far from mature.Therefore,the cooling and heat dissipation method of coupling liquid cooling and air cooling is an effective measure to solve the heat dissipation problem of high heat density cabinet at present.In view of the problems existing in the current data center cooling technology,combined with the characteristics of different cooling modes,a liquid cooling heat dissipation device for cooling the communication cabinet is designed.The device is placed on the cabinet partition and is in direct contact with the outside of the cabinet heating chip.The heat dissipation of the chip is exported through heat conduction and sent to the liquid cooling heat dissipation system,At the same time,the residual heat of the cabinet is convected and dissipated by the air cooling mode,which reduces the energy consumption of the air conditioning system of the data center,and can also recycle the heat brought out by the liquid cooling system.Through the established experimental test platform,the heat dissipation performance of liquid cooled high heat density cabinet under different heat source power conditions is compared and tested and analyzed;The changes of heat dissipation,heat dissipation efficiency,device cop and internal temperature of simulation cabinet under test conditions of different heat source power,different coolant temperature,different coolant flow and different wind speeds are analyzed,The heat dissipation performance evaluation parameters of the direct contact flat plate liquid cooling heat dissipation device are obtained,and the heat dissipation model of the flat plate liquid cooling heat dissipation device is established,which provides a basic theoretical and experimental basis for the engineering application of the liquid cooling heat dissipation technology of the high heat density cabinet in the data center.In the experiment,when the power of the simulated heat source inside the cabinet increases from 800W to 2200W,the coupling heat dissipation of flat plate liquid cooling and air cooling shows a linear increase trend,and the heat dissipation efficiency of the heat dissipation system also decreases significantly with the increase of power;When the initial temperature of the coolant increases from 24℃to 28℃,the cumulative heat dissipation and heat dissipation efficiency of the liquid cooling and air cooling heat dissipation devices decrease;When the coolant circulation flow increases from 0.58m~3/h increased to 0.98 m~3/h,the cumulative heat dissipation of the heat dissipation device gradually increases;When the air flow rate in the cabinet increases from 4m/s to 6m/s,the heat dissipation capacity and efficiency of the heat exchanger are improved,but the increase is small.The communication cabinet adopts the direct contact plate liquid cooling and air-cooling coupling heat dissipation device for heat dissipation.After running for 4 hours under different working conditions,the cumulative heat dissipation range of the device is 8689.23kj～20855.55kj,the heat dissipation efficiency is 62.52%～91.52%,and the maximum heat dissipation performance coefficient（COP）can reach 1.64.The experimental results show that the direct contact plate liquid cooling and air-cooling coupling heat dissipation device has good heat dissipation performance,which can make the IT equipment in the cabinet work in a relatively good environment and help to ensure the safe and stable operation of electronic equipment. |
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