| In recent years,high-end electronic products gradually to better,more portable direction of development,which put forward more stringent requirements for heat dissipation technology.The cooling technology of electronic products is not only confined to the cooling of electronic products,but also the voice of the strict control on cooling.As a heat pipe device applied to heat dissipation on the two-dimensional plane,the temperature equalizing plate adopts the heat principle of infinite cycle phase transformation between gas--liquid and liquid--gas to ensure better heat dissipation effect and temperature equalizing effect.This can not only solve the problem of limited heat dissipation of traditional cooling devices,but also reduce the consumption of other energy and control the impact of noise generated when it works normally.Setting the cavity inside the radiator,putting into the working medium,is connected internally as a unified whole,Through the heat dissipation device at the bottom of the waste heat generated by electronic products,it can pass through the shell of the homogenizing plate,the transmission to the inner wall of the homogenizing plate so that the liquid state of the working medium in the cavity changes,forming an infinite circulation state,which can greatly strengthen the heat dissipation device temperature characteristics and heat dissipation performance.In this paper,Design Modeler in software Workbench is used to build the two dimensional model of the homogeneous temperature radiator,the numerical simulation is carried out,and the law is obtained.The experimental platform was set up to conduct experimental analysis and research on a homogenizing temperature plate,and the experimental platform was modeled by Solid Works professional drawing software.The numerical simulation analysis of the established model was carried out by Fluent.（1）In this paper,the Design Modeler function in Workbench is used to draw the unit body of the two-space homogenizing plate,and meshing in Workbench is used for grid division.Simplified numerical simulation research is carried out by Fluent.In numerical simulation,the length of element body is set as a fixed value,and the width of different element body（thickness of uniform temperature plate）is compared and analyzed as a variable.The results show that in two-dimensional space,under the condition of normal operation of uniform temperature plate element,a steam ring will be generated in the cavity due to the reason of gas-liquid phase change,which is vortex shape.With the increase of the thickness of the homogenizing plate element,the flow velocity in the middle position of the cavity becomes faster and faster,and the corresponding vortex steam ring also becomes faster and faster,indicating that the heat dissipation effect will be better with the increase of the thickness of the homogenizing plate.At the same time,a 6mm×3mm cell was selected to carry out numerical simulation of the internal cavity pressure,the temperature cloud and velocity cloud of the gas working medium inside the cell were obtained.Four typical pressures of the internal cavity are simulated.Through the analysis,it is concluded that with the gradual increase of the internal pressure of the temperature equalizing plate,the flow rate of the internal working medium is also faster and faster,which also indicates that the change of the pressure of the internal cavity of the temperature equalizing plate can affect the heat dissipation effect of the temperature equalizing plate,and the heat transfer effect is stronger with the increase of the pressure.（2）Through the simulation analysis of two-dimensional space,a size quite mean temperature of the plate as the research object was chose,,its internal with copper column is uniformly distributed in all panels,in the internal cavity for the normal running of the panels and prevent deformation plays very well supported,around half of the pillars will decorate sintered copper powder as a liquid core.At the same time,a very thin suction core of the same material is arranged on the inner wall of the homogenizing plate cavity so that there is a strong capillary force inside the homogenizing plate for fluid transport.In order to study its heat transfer characteristics,an experimental platform was set up.By comparing the pure copper plate of the same size,the heat transfer analysis of the two heat dissipation elements was carried out.In the experiment,cast aluminum plate was used to simulate the electronic heating element.By adjusting the voltage of the DC power supply,the heat flux of the heating and cooling element was changed in the range of 1.6 ～ 21W/cm2.The heat dissipation effect of the homogeneous temperature plate and pure copper plate with the same heat dissipation area was tested respectively.The results show that when the heating power reaches 170 W,the temperature at the center of heat source on the evaporation surface of uniform temperature plate is close to 356 K,while the central temperature of pure copper plate with the same heat dissipation area is 386 K under the same conditions.The comparison of heat transfer performance with pure copper plate shows that under the same heating condition,the thermal resistance value and temperature homogeneity of uniform temperature plate are better than that of pure copper plate with the same size.（3）Using the professional drawing software of Solid works established the corresponding model of the experimental platform,through the meshing of commercial software Workbench for grid division and comparison,select the high-quality grid for numerical simulation analysis of the established model.In this paper,by means of numerical calculation,the pure copper plate is compared with the homogeneous plate with the same size internal structure of copper column as the support structure and 50% of the copper column covered with sintered copper powder sheet as the suction core,and its numerical simulation and theoretical analysis are carried out.The results show that: 1)The heat transfer performance of homogeneous plate with copper column as support structure and 50% copper column covered with sintered copper powder sheet as suction core is better.This is because the sintered copper powder can make the small droplets condensed at the condensation end quickly return to the evaporation end,effectively reduce the working medium return path and greatly shorten the time of the droplets from the evaporation end to the condensation end to prevent drying phenomenon;2)Although there are differences between numerical simulation analysis and experimental research on temperature homogeneous plate,it can play a good verification role in experimental research to a certain extent,bring guiding significance in performance optimization,and also greatly save the time and cost of experiment. |
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