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Research On Micro-etching Of Polymer Plastics Before Electroless Plating

Posted on:2022-11-13Degree:MasterType:Thesis
Country:ChinaCandidate:L L LiuFull Text:PDF
GTID:2511306752993859Subject:Analytical Chemistry
Abstract/Summary:PDF Full Text Request
With the rapid development of social economy,the related technology based on plastics has been developed rapidly,and the use of plastics has been more extensive.The epoxy resin,polypropylene plastic and polycarbonate have been widely used in a variety of industries with heat resistance,impact resistance and other excellent properties.Various properties of epoxy resin,polypropylene plastic and polycarbonate plastics could be improved by surface metallization.The wettability,surface roughness and the adhesion strength of untreated plastic surface were small.At the same time,the difference in surface energy made the thermodynamic energy mismatch between the plastic and the metal,which resulted in the phenomenon of bubbling,coating shedding and even leakage of metal coating.In order to increase the surface roughness,surface hydrophilicity and the adhesion strength,plastic surfaces need to be etched before the surface metallization.Plastic surface treatment methods mainly included plasma,chemical etching,UV photocatalysis and corona.Due to the difficulty of operation and the cost of production,chemical etching was employed to modify the surface of epoxy resin,polypropylene plastic and polycarbonate substrate in this work.After the plastic substrates were treated properly by the above methods,the desired effects were obtained.The main works of the dissertation were as follows:1.The epoxy resin was etched with Mn O2-H2SO4-H2O system at 60?and the manganese dioxide content was 60 g·L-1 after swelling treatment.The results indicated that the oxidation capacity of the etching system exhibited a trend of firstly increasing and then decreasing with the increase of the volume ratio of sulfuric acid to water.Increasing the etching temperature and the etching time were beneficial to the etching reaction.However,the epoxy resin would be worse when the temperature was too high and the time was too long.The wettability,surface roughness and the adhesion strength of epoxy resin substrate were substantially increased after the surface modification with the manganese dioxide content of 60 g·L-1 and the volume ratio of sulfuric acid to water was 2.5:1 at the etching temperature of 60?and the etching time of 15 minutes.X-ray photoelectron spectroscopy(XPS)analysis showed that hydrophilic groups such as-COOH appeared on the surface of epoxy resin after etched,and the formation of polar groups enhanced the hydrophilicity of the substrate surface.High surface roughness and strong surface hydrophilicity made the maximum adhesion strength between epoxy resin surface and copper coating reach to 7.0 N·cm-1.2.In this paper,Mn O2-H2SO4-H3PO4-H2O quaternary corrosion system was formed by adding phosphoric acid into Mn O2-H2SO4-H2O system.The effect of different volume ratio of sulfuric acid,phosphoric acid to water and etching times upon the etching effect were investigated when the manganese dioxide content was 60 g·L-1 and the etching temperature was 60?.The results showed that the oxidation capacity of the etching system was enhanced by adding phosphoric acid because of the complex formed a complex.The surface roughness of the epoxy resin substrate was significantly increased from 2.05 nm to 121 nm.At the same time the dense and uniform microholes were formed on the plastic surface when the manganese dioxide content was 60 g·L-1 and the volume ratio of sulfuric acid and phosphoric acid to water was 3.0:1:1 at the etching temperature of 60?and the etching time of 20 minutes.The contact angle result indicated that the hydrophilicity of epoxy resin substrate surface was enhanced after the etching treatment.And X-ray photoelectron spectroscopy(XPS)analysis further showed that the side chains in the polymerization chain were oxidized to form the hydrophilic group of-COOH after etching treatment.The formation of hydrophilic group increased the adhesion strength between epoxy resin substrate surface and copper coating,and the adhesion strength reached to 7.2 N·cm-1.3.In this paper,the environmentally friendly system of Mn O2-H2SO4-H2O was used to study different etching time and etching temperature treatments for etching the surface of polypropylene plastic substrates when the manganese dioxide content was 60 g·L-1 and the volume ratio of sulfuric acid to water was 3.0:1 at 80?.It was founded that the wettability,surface roughness and the adhesion strength of polypropylene plastic substrate were substantially increased after the surface etching with the manganese dioxide content of 60 g·L-1 and the volume ratio of sulfuric acid to water of 3.0:1 at 80?and 100 minutes.In addition,the adhesion strength between the polypropylene plastic substrate and copper plating layer reached to 3.5 N·cm-1.The results of X-ray photoelectron spectroscopy(XPS)analysis showed that-COOH hydrophilic group was formed on the surface of polypropylene plastic.Meanwhile,the contact angle between polypropylene plastic surface and water decreased from 91.7°to 62.6°.4.In this paper,a new ternary corrosion system of KMn O4-H2SO4-H2O was designed and also was used as the etching system to etch the polycarbonate plastics at70?and the potassium permanganate content of 6 g·L-1.The results showed that the wettability,surface roughness and the adhesion strength of polycarbonate plastics substrate were substantially increased after the surface modification 25 minutes when the potassium permanganate content was 6 g·L-1 and the volume ratio of sulfuric acid to water was 2.5:1 at 70?etching temperature.The formation of-COOH hydrophilic groups on the surface of polycarbonate plastics contributed to the surface contact angle decreasing from 83.5°to 53.7°.In addition,the adhesion strength between the polycarbonate plastics substrate and copper plating layer reached to 4.1 N·cm-1.
Keywords/Search Tags:Manganese dioxide, Swelling, Etching, Adhesion strength
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