High-current And High-density Three-dimensional Flexible Interconnection Technology Resistant To Harsh Aerospace Environments

With the diversification and high performance of spacecraft functions,the higher total power of spacecraft and the smaller electronic equipment,the micro spacecraft has entered a new development era.In the flexible interconnection technology,the arbitrary distortion of the flexible interconnection circuit realizes the high density of the device-level design,and the organic integration with the control board forms an integrated product,which achieves the high utilization of the limited space of the spacecraft.Three-dimensional flexible interconnection technology provides a flexible interconnection circuit made of flexible insulating substrate,which meets the requirements of electronic products with high current,high density,miniaturization and aerospace resistance.Flexible interconnection technology is one of the core technologies of electronic product manufacturing in the future.With the rapid growth of electronic industry,its application fields will be further expanded.In this paper,the design and optimization of three-dimensional flexible interconnection in space-resistant environment mainly studies the 3D integrated high-density design of flexible circuit interconnection to meet the miniaturization development of electronic products,and studies the design of high-current flexible circuit with low heat dissipation to meet the increasing demand of spacecraft electrical power.Due to the direct connection of high-frequency signal lines,impedance matching usually occurs,which affects the performance.Therefore,it is necessary to explore the effects of circuit flexibility,plate defects and roughness on impedance matching.According to the requirements of aerospace power products for flexible interconnection technology.Carry out research on precise lamination and mounting of flexible materials and complex three-dimensional bending,so that the bending radius is not more than 1mm.Study the impedance matching design of high-frequency flexible printed circuit board connection,and explore the influence of surface defects and roughness of flexible interconnection lines on impedance,so as to provide theoretical support for controlling impedance within 5% under high-frequency transmission of aerospace electronic products.When the transmission current of the flexible circuit module reaches 30 years,the interconnection line realizes high current carrying capacity and good heat dissipation performance considering the high density of interconnection.