Study On Additive Manufacturing Method And Performance Of Typical Electronic Components

Electronic components including electronic element and electronic device are the basic unit of constructing electronic products and equipment.At present,the traditional manufacturing technology of electronic components is still a subtractive manufacturing technology basing on deposition-lithography-etching,etc.However,it has such disadvantages as multiple step,long process,environmental unfriendliness,serious waste of raw materials,and much difficult in achieving three-dimensional（3D）curved surface processing.While additive manufacturing method has many advantages,e.g.,fewer steps,saving raw materials,and convenient 3D processing;Moreover,the adhesion strength between the components and substrates is an important factor that affects the reliability.For solving these problems,corresponding research is carried out and the main results and conclusions are as follows:By micro-pen direct writing of active layer IGZO（atomic ratio:In:Ga:Zn=12:1:4）and depositing Al electrode,an IGZO-TFT device was fabricated.Under the optimal direct-writing parameters,the thickness of the obtained IGZO film was about 20 nm,the mobility of the IGZO-TFT device was 1.43 cm²/V·s,and the switching current ratio was greater than 10⁸.These were comparable to the performance of the devices prepared by inkjet printing,which was slightly less than the performance of the devices prepared by subtractive manufacturing technology.This study provides the possibility and feasibility for the micro-pen direct-writing additive manufacturing of TFT on 3D curved surface.To prepare ruthenium oxide resistors on the surface of organic polymer composite epoxy resin-glass fiber composite（FR4）that is not resistant to high temperature,a low-temperature thermally-cured Ru O₂ resistor paste was prepared.By adjusting the content of ruthenium dioxide,silver,epoxy resin,ethyl cellulose,etc.,the volume resistivity of the resistor after curing at 80℃could be changed in the range of∞～0.1Ω·cm.The prepared Ru O₂chip resistor had good surface morphology and uniformity,and its adhesion strength with the FR4 substrate could reach the highest level 5B of the method B-tape method in the test method（ASTM D3359-08）provided by the American Society for Testing and Materials（ASTM）standard.This study provided the possibility and feasibility for the micro-pen direct-writing additive manufacturing of TFT on 3D curved surface.While the prepared Ru O₂ resistor paste could be cured at low temperature,formed by additive manufacturing,and had high adhesion strength and reliability with FR4 substrate.In conclusion,these results established detailed experimental and material foundation for the additive manufacturing of 3D curved electronic components.