Miniaturization Design Of Micro-packed Phase Locked Frequency Source

Frequency sources play a core role in electronic communication systems,it is important in the field of high-resolution radar imaging and high-precision measuring instruments.the foundation of domestic frequency synthesis technology is poor,there are many problems in the development of frequency sources,one of them is reflected in many application scenarios of frequency sources,and the core chip of the solution comes from imports from abroad,its core technology and chips from the domestic frequency source scheme occupies a low market share.As U.S.-China relations change,the localization of frequency source schemes has become increasingly important.This thesis uses the existing pure domestic frequency source chip,using High Temperature Co-firing Ceramics(HTCC)process and gold wire bonding technology,designed a miniaturized frequency source,and the designed product size is only 9mm× 9mm× 2mm,the main work of the thesis is as follows:(1)The design of a domestic chip frequency source,using HTCC technology and gold wire bonding technology to achieve miniaturization design,the indicators of the project requirements: output frequency 11.6GHz,spurious below-50 d Bc,harmonics below-20 d Bc,size 9mm×9mm×2mm.(2)Ansys Icepak software is used for thermal simulation modeling analysis of the miniaturized frequency source ceramic package shell,it provides simulation support for HTCC process selection of miniaturization of PLL.(3)In order to ensure the transmission efficiency of the RF signal generated from the top layer of the ceramic package shell to the bottom layer,the S-parameter modeling and analysis are carried out.By adding the metal column structure,the wide and low-pass structure is designed,which has good electromagnetic transmission efficiency in the whole X-band(S11<-15 d B).After processing test,the test results are as follows:output frequency 11.6GHz,output power 10.57 d Bm,spurious is-57.59 d Bc,harmonic suppression is-20.46 d Bc,the overall phase noise distribution is:-92.05 d Bc/Hz@1k Hz;99.38 d Bc/Hz@10k Hz;93.66 d Bc/Hz@100k Hz;-113.58 d Bc/Hz@1MHz,size only 9mm×9mm×2mm.