Study And Design Of Millimeter Wave Active Integrated Antenna

With the increasing demand for higher data rates in fifth-generation mobile communications（5G）,the traditional Sub-6 GHz spectrum resources are in short supply and cannot meet the demands of wireless communication systems for high capacity and high data throughput.The mmWave frequency band has a wide spectral bandwidth,and mmWave power amplifier active integrated antenna（AIA）designs can provide better performance with the advantages of low cost and compact size.In order to further reduce the interconnection loss and meet the requirements of system miniaturization and integration,Antenna-in-Package（AiP）has also become a hot topic in current research.In this thesis,combined with the topic selection of scientific research projects,based on the microstrip patch antenna with simple structure and easy integration,the research and design of millimeter-wave active integrated antenna and packaged antenna are carried out.The main work of the thesis is as follows:1.Based on the demand for high gain in millimeter wave band,a millimeter wave 2×2 microstrip patch array antenna is designed.The-10 dB bandwidth of the antenna covers the n258（24.25-27.5 GHz）frequency band.The specific impedance bandwidth is 23.40-27.87 GHz and the maximum gain is 12.1 dBi.On this basis,an active integrated structure is proposed.The RF signal output by the RF power amplifier chip is fed to the radiation patch through direct electromagnetic coupling,so as to realize low loss and bandwidth expansion between the RF power amplifier chip and the external antenna.Through the comparison between simulation and measurement,its impedance bandwidth is wider than that of passive antenna,and has good radiation performance.2.An active integrated 2×2 array antenna based on gold wire bonding interconnection is proposed.First of all,the above-mentioned 2×2 millimeter-wave microstrip array antenna is miniaturized,and a rectangular slotted decoupling structure is introduced between the patch units to suppress mutual coupling by using the method of field pair decoupling.The final designed 2×2 array antenna size is 0.957 λ0×1.130λ0×0.044λ0.Secondly,the interconnection between die and antenna is realized by using gold wire bonding technology to form an active integrated antenna,and the interconnection matching network is designed and analyzed to better realize the interconnection matching of gold wire bonding line.Finally,the simulation and measurement of AIA are compared.The impedance bandwidth of AIA is 26.7-28.2 GHz,and the maximum gain of AIA is 26.35 dBi.3.A millimeter-wave antenna-in-package based on eGFO process is proposed.The antenna consists of an antenna layer,a glass packaging layer and a PCB layer.The antenna feeding is realized by the method of proximity coupling.The chip and the antenna are interconnected by through glass vias,and the RF signal output by the chip is transmitted to the antenna feeder through flip-soldering and TGV,which in turn couples to the rectangular patch so that the rectangular patch radiates energy into free space.The antenna layer and the glass packaging layer are separated by the floor,which effectively reduces the electromagnetic mutual coupling effect between them.The chip floor,antenna floor and PCB ground layer are connected as a whole to form a common ground and maintain a consistent common level and equal potential.The-10 dB bandwidth of the antenna covers the n258（24.25-27.5 GHz）frequency band.The specific impedance bandwidth is 24.22-27.52 GHz and the maximum gain is 7.32 dBi.