Analysis And Management Of Power Semiconductor Device Reliability Test Date

Power semiconductor devices are the core components of various electronic systems.They are widely used in consumer electronics,automotive,communications,rail transit,power generation and distribution,industrial control and other fields of electrified products.Power semiconductor devices are seemingly simple but extremely complex products to manufacture.In the automotive power system,it carries the functions of AC and DC power conversion,high and low voltage power conversion,Power amplification and reduction and other functions.With the continuous development of transportation electrification,the demand for power semiconductors will be greatly increased,and the reliability of devices will be receive more and more attention.With the continuous development of semiconductor production technology,the emergence of new materials and processes will affect the quality of products.and the application environment of semiconductor devices at this stage is getting worse and worse.For example,the power electronic equipment of ships,automobiles and military industry are used in high temperature,high humidity and high corrosion environments,which lead to serious challenges in the use of semiconductors.Reliability test is used to verify whether it meets the required reliability level in the process of product development and production.It is an important means to produce high reliability products.This thesis mainly analyzes and studies from the following aspects:1.This thesis discusses the reliability related theory,the main factors affecting the reliability of semiconductors,Common models of reliability accelerated test include Arrhenius model,Hallberg peck model and inverse power rate model.2.The main failure modes of power semiconductor are analyzed.Based on the national military standard,American military standard and relevant standards of microelectronics industry,combined with the product manual,the high-temperature storage test,temperature cycle test,high-temperature reverse bias test,temperature and humidity bias test,high-pressure cooking test and intermittent operation life test are formulated.Complete the accelerated life test within the specified time.Verify the performance of the product in the test of high temperature,high pressure and high humidity.3.The reliability test of ultra fast recovery power diode is completed according to the current industrial standard.Compare the changes of forward conduction voltage VF parameters,reverse leakage current IR and reverse voltage VZ parameters of the product under different conditions and at different times.According to the reliability test results,the service life of the device under normal conditions is calculated.4.Use electrical,physical and chemical means to analyze the failure of the samples,check the failure causes of the samples and analyze the failure mechanism.Return the results to relevant R & D and manufacturing departments to fundamentally eliminate or weaken the failure mode and improve the reliability and service life of products.Finally,based on the business process of reliability test,the key data information is analyzed,and the database is designed to store the data of reliability test,which is convenient for the query and analysis of test data.When the product has defects such as grain,PN junction,welding wire and grain welding in the process of R & D,design and manufacturing.Through the reliability test,the product can quickly verify the performance of the product and find out the failure mechanism,provide a clear direction for the improvement of the product,and play a key role in the R & D and manufacturing of power semiconductor.