The swift progress in 5G wireless communication technology has resulted in the widespread utilization of microwave dielectric ceramics in various areas including mobile communication and filtering,attributed to their superior properties such as high dielectric constant,high quality factor,and low dielectric loss in comparison to other ceramic materials.The continuous development of ceramic dielectric filter and the improvement of technology have put forward higher requirements for conductive silver paste.In order to adapt to the iterative update of the ceramic dielectric filter silver paste.The present investigation aimed to produce a conductive silver paste suitable for the metallization of MgTiO3 microwave ceramics utilizing a lead-free system glass that encompasses ZnO-B2O3-SiO2.The investigation was principally focused on the specific research of the preparation and performance of the lead-free system glass encompassing ZnO-B2O3-SiO2 and the metallization properties of MgTiO3 ceramics.This study describes the preparation of a ZnO-B2O3-SiO2 lead-free glass system that undergoes a chemical reaction with MgTiO3 ceramics using the conventional high-temperature melting-quenching method.The properties of the resulting glass powder were comprehensively investigated using XRD,TG-DSC,SEM,and other analytical techniques.The experimental data indicate that the ZnO-B2O3-SiO2 glass exhibits excellent amorphous properties.The glass transition temperature(Tg)of the glass was found to decrease and then increase with the increasing ZnO content,which can be attributed to the structural transformation of[ZnO6]and[ZnO4],[BO3]and[BO4]units in the glass network structure.After considering all aspects,a ZnO content of 45 wt%was found to be optimal for the preparation of ZnO-B2O3-SiO2 glass with a low glass transition temperature(Tg=579℃)and high thermal stability(ΔT=105℃).Concurrently,MgTiO3 ceramic-metal conductive silver paste was prepared using ZnO-B2O3-SiO2 glass as the binder with a ZnO content of 45 wt%,and the properties of sintered silver thick film were comprehensively examined.The outcomes of the study reveal that:1.The resistivity of the silver thick film decreases as the sintering temperature increases,while the adhesion increases with the rise in sintering temperature and duration.2.The rise in glass powder content obstructs the connection between silver particles,leading to a reduction in the silver thick film’s density and an increase in its resistivity.The adhesion of the silver thick film initially increases and then decreases with the increase in glass powder content.The primary role of the glass binder in the conductive silver paste is to facilitate the formation of the silver network and enhance the adhesion strength by wetting the ceramic substrate.3.When the glass content in the conductive silver paste is 1.1 wt%,and sintered at a peak temperature of 830℃for 10 min,the resistivity of the silver thick film is 1.81μΩ·cm,and the adhesion reaches 39.4 N/mm2.4.Introducing irregular silver powder into 20 wt%of a single microsphere silver powder remarkably improves the performance of the silver thick film,causing the resistivity to decrease from 2.01μΩ·cm to 1.81μΩ·cm.The particle size of the glass powder also has a notable effect on the performance of the conductive silver paste.5.It was observed that,in addition to improving adhesion through capillary action between the silver thick film and the ceramic substrate,the ZnO-B2O3-SiO2 glass binder undergoes a chemical reaction with the MgTiO3 ceramic substrate,generating an intermediate phase ZnTiO3,which further enhances the adhesion of the silver thick film. |