| Array antenna contains a large number of power devices such as power supply and T/R.However,the efficiency of T/R components in China is only about 30% at present.When the radar system is working,the T/R components with dense antenna arrays will produce a large amount of heat dissipation.The T/R component is very sensitive to temperature,and the continuous accumulation of heat will make the temperature of the T/R component too high and the temperature difference too large,which will have a serious impact on the electrical performance of the antenna.Phased array antenna to remote detection,high integration direction,internal heat flux will be more and more big,but due to the cooling system of existing mature is separated from the heat source to the end heat sink of encapsulation material,thereby limiting further improve its cooling ability,therefore,cannot meet the future demand for high power,high power dissipation of heat dissipation.Embedded coolant pumps coolant directly into the chip,minimizes the total thermal resistance across numerous packaging materials,and has a very high heat dissipation capacity.Research on embedded heat dissipation can lay a foundation for breakthrough of key technology of heat dissipation in the development of next-generation high-performance electronic equipment.The research object of this paper is an active phased array antenna,based on the electromechanical thermal coupling theory,aiming at the influence of the maximum temperature homogeneity on the electrical performance of the antenna,the most efficient way of heat dissipation is embedded cooling.The embedded heat dissipation is studied from two dimensions of antenna unit and array antenna,and compared with the traditional remote cooling scheme based on liquid cold plate.The specific work of this paper is as follows:(1)In view of the technical dilemma that the current mature cooling mode cannot meet the demand for high-power heat dissipation in the future,the embedded heat dissipation is firstly studied with a single chip as the carrier.As a comparison of embedded cooling methods,a traditional remote cooling scheme based on liquid cold plate is designed for a single chip.The maximum temperature is 44.19℃.Taking a single chip as the object,an embedded heat dissipation scheme with a penetrating micro-channel structure is proposed.The maximum temperature of the optimized structure is 23.53℃,which is 46.75% lower than that of the cold plate scheme.This thermal design scheme overcomes the heat dissipation barrier of the traditional remote cooling mode and achieves excellent heat dissipation effect.(1)Based on the idea that the turbulence structure can promote heat transfer,the swept breakpoint micro-channel embedded heat dissipation structure is designed and optimized.The maximum temperature is 23.34℃,which is 47.18% lower than the cold plate scheme.Compared with the hole-through microchannel structure,the average temperature performance is improved by 8.44%.(2)Aiming at the complex problem of broken point structure,truncated micro-channel embedded heat dissipation structure is designed.The maximum temperature is 23.40℃,and the cooling capacity is increased by 47.05% compared with the cold plate scheme.Compared with the hole-through microchannel structure,the average temperature performance is 6.5%higher.(3)A micro-channel embedded structure with trapezoidal convex groove is designed to make the fluid flow vertically to enhance heat dissipation.The results show that the maximum temperature is 23.56℃,which is 46.68% lower than that of the liquid cold plate scheme.Compared with the hole-through microchannel structure,the average temperature performance is increased by 2.6%.The comprehensive heat transfer performance of the breakpoint structure is the best according to the water-thermal comprehensive performance parameters.Compared with the traditional liquid cooling plate,the simulation results of single chip show that the embedded cooling method has better heat dissipation ability.(2)In view of the difficulty in heat dissipation of high-power chips in phased array antennas and the high pump power required,the bionic structure is introduced into embedded cooling by drawing on the transport network structure with the characteristics of low consumption and high efficiency after biological evolution,so as to reduce energy consumption as much as possible while solving the heat dissipation problem.Therefore,an embedded heat dissipation scheme resembling honeycomb microchannel structure is designed for the chip unit.The maximum temperature is 23.52℃,which is 46.78% lower than that of the liquid cold plate scheme.Compared with the hole-through microchannel structure,the temperature homogenization performance is increased by 7.8%.The simulated spider web heat dissipation structure was designed and optimized.The maximum temperature was 23.41℃,which was 47.02% lower than the liquid cold plate scheme.Compared with the hole-through microchannel structure,the average temperature performance is increased by 2.6%.The simulation results show that the integrated heat dissipation performance of the honeycomb embedded scheme is better,and the bionic structure has a certain heat dissipation advantage.(3)Taking array antenna as the research object,the previous research results are applied to array antenna.As a comparison of the embedded heat dissipation scheme of the rear array antenna,the liquid cold plate is used for heat dissipation first.The maximum temperature is50.55℃,and the temperature difference is 2.0℃.(1)Using embedded cooling scheme,considering the layout of the chip signal pin,choose well versed in microchannels structure in order to increase the cooling scheme of the universal,at the same time,in order to make pumping at the same time each chip internal fluid for cooling and not cause the chip temperature difference is too big,therefore,designed a rectangular shunt way through microchannels structure embedded cooling scheme,the high temperature is 24.81 ℃,The temperature difference is 1.99℃.Compared with the liquid cold plate cooling scheme,the maximum temperature is reduced by 50.92%.However,the flow rate of each branch channel is uneven and different in the rectangular splitter channel structure.(2)The trapezoidal split-through micro-channel embedded structure was designed to improve the uneven flow rate of the rectangular split-channel structure.The simulation results show that the maximum temperature is 24.75℃ and the temperature difference is1.86℃,which is reduced by 51.04% compared with the liquid cold plate scheme.Compared with the rectangular splitter structure,the average temperature performance is improved by6.53%.The simulation data of array antenna show that the cooling effect is very obvious by adopting embedded cooling scheme. |
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