Experimental And Numerical Simulation Study Of Embedded Manifold Microchannel Heat Sink

With the continuous development of semiconductors,the heat dissipation problem of high-power chips has become increasingly prominent,and compact and efficient heat management technology has become a key requirement for the development of electronic technology.Microchannel heat dissipation technology has broad application prospects in chip heat dissipation in servers,tablets,smartphones,and other devices due to its good compatibility with chips and efficient and stable heat dissipation ability in small spaces.Compared with traditional microchannels,embedded microchannel heat sinks can shorten the heat transfer path and reduce the interface thermal resistance through the coordinated design of chips and microchannels,greatly improving heat dissipation capacity and integration.To improve the heat dissipation capacity of embedded microchannel heat sinks,this paper designs and establishes an embedded manifold microchannel heat dissipation system,and systematically studies the effects of microchannel topological structure parameters on the heat dissipation capacity and flow resistance of embedded manifold microchannel heat sinks through simulation and experimentation,providing experimental and theoretical support for the strengthening and structural design optimization of embedded microchannel heat sinks.To improve the efficiency of microchannel heat dissipation,this paper establishes an embedded manifold microchannel heat sink model that integrates microchannel cooling modules and thermal test chips.The heat sink uses continuous S-shaped microchannels and manifold flow to form layered and segmented flow,and uses numerical simulation methods to study the heat transfer characteristics of the working fluid in the manifold flow and the coupling of the manifold heat sink and the chip.The effects of flow rate and S-shaped microchannel structural parameters on heat dissipation and flow are obtained,and the characteristics of the heat sink are evaluated based on parameters such as the average temperature of the heating surface,the average Nusselt number of the heat transfer surface,pressure drop,and comprehensive performance factor(a parameter that comprehensively considers the effects of heat transfer performance and flow resistance on the heat sink).The research results show that under the same inlet flow rate,the heat dissipation effect of the manifold S-shaped microchannel is about 33%higher than that of the manifold rectangular microchannel,and the optimal combination of S-shaped microchannel structural parameters is obtained through analysis of the comprehensive performance factor.Based on the established embedded manifold microchannel heat sink model and the optimized structure of the S-shaped flow channel,a micro-compact embedded manifold S-shaped microchannel heat sink is developed.Using Micro-ElectroMechanical System(MEMS)technology,an S-shaped microchannel array with the aspect ratio of up to 10(width 15 μm,depth 150μm)is successfully constructed,and the microchannel array and thermal test chip are integrated into a microchannel board and encapsulated with the manifold to finally develop the embedded manifold S-shaped microchannel heat sink,with an overall size of 40 mm ×40 mm × 14 mm.This work can provide reference for the structural design and processing of compact embedded microchannel heat sinks.This paper conducted single-phase and two-phase heat dissipation experiments on the developed embedded manifold S-shaped microchannel heat sink,studied its heat transfer and flow performance under different mass fluxes and heat flux densities,and compared it with the rectangular microchannel heat sink.The research results show that the embedded manifold S-shaped microchannel heat sink can dissipate 813 W/cm2 of heat flux when the local maximum temperature on the chip surface is less than 120℃and the average temperature rise is less than 69℃.Under the same inlet mass flux,the heat flux of the embedded manifold S-shaped microchannel heat sink is about 45%higher than that of the traditional manifold rectangular microchannel heat sink.This paper established an embedded manifold microchannel heat sink model that integrates microchannel cooling modules and thermal test chips.The S-shaped flow channel and manifold were used to form fluid layer-by-layer segmented flow,and the heat transfer characteristics of the working fluid in the manifold layered flow and the coupling of the manifold heat sink and the chip were studied using numerical simulation methods.Then,using MEMS technology,an embedded manifold S-shaped microchannel heat sink with a large aspect ratio S-shaped microchannel array was manufactured,and an experimental system was established for single-phase and twophase experiments.