Parametric Design Of Large Size Silicon Wafer Tank Cleaning Machine

Silicon wafer cleaning is one of the key technologies in the chip manufacturing process,and it is also the most common process in the entire manufacturing process.Wet cleaning of silicon wafers is currently the mainstream silicon wafer cleaning method due to the advantages of mature technology,low cost and high efficiency.Tank cleaning equipment has the advantage of high cleaning capacity and occupies a considerable market share.In this paper,a set of large-size silicon wafer tank cleaning equipment is developed through the research of silicon wafer cleaning technology.The main research work includes:(1)Based on the silicon wafer wet cleaning process,a set of tank cleaning machines that can clean 8 ",12",16 ",18" and other large-sized silicon wafers is designed.Optimize the traditional silicon wafer wet cleaning process,adopt the cleaning sequence of removing organic impurities first,then removing alkaline metal impurities,and finally removing surface particle impurities.According to the requirements of this process,the structure of the cleaning machine is designed.The main contents include: Universal flower basket design;equipment internal space layout design;cleaning tank structure design,ultrasonic frequency and power selection of ultrasonic-assisted cleaning tank,ball screw and servo motor selection calculation of slow pull auxiliary device;manipulator structure design and quantity selection;Structure design of automatic loading and unloading table.(2)According to the technological process and the function of the cleaning tank,the piping system and air system of the cleaning machine are designed.The main contents include: design of chemical tank,QDR tank,OF tank and drying tank piping system;selection and calculation of air bag pump of chemical tank and magnetic pump of OF tank;DIW general water inlet pipeline and washing machine waste discharge system The design of the cleaning machine establishes the connection between the overall pipeline of the cleaning machine and the factory pipeline;the design of the N2 supply air circuit and the pneumatic control circuit.(3)The application feasibility of the cleaning tank structure and the manipulator structure is verified.The simulation platform based on Solidworks software checks the strength of the quartz main tank,ultrasonic overflow tank and OF tank of the chemical tank.The results show that:when the thickness of the quartz main tank is 5mm,its structure meets the strength requirements;When the thickness of the SUS316 L stainless steel plate of the flow tank is 2mm,the side plate and bottom plate do not meet the strength requirements.After optimizing the tank structure and setting the thickness of the stainless steel plate to 3mm,the strength meets the requirements;when the thickness of the OF tank NPP plate is 15 mm,the tank structure meet strength requirements.Based on the Workbench platform of ANSYS,the strength of the robotic arm and the hollow support column of the manipulator is checked.The results show that the strength requirements are met when the diameter of the robotic arm is 30 mm and the wall thickness of the hollow support column is 1.5mm.Using the modal analysis results of the gripping mechanism mounting seat and the lifting servo motor mounting seat,it is determined that there is no resonance phenomenon when the manipulator is running.(4)Developed a set of parametric design system for tank cleaning machine.On the basis of the designed cleaning machine structure,the cleaning machine was divided into multiple sub-components,and the key parameter variables of each sub-component were extracted to realize the parameterization of each sub-component.Design,parametric subcomponent assembly of the cleaning machine is also parametric.