Research On Chip Level Microchannel Heat Dissipation Technology Based On High Power Density Heat Source

In recent years,with the development of electronic products towards high integration,high power and miniaturization,the packaging density and power consumption of electronic products are gradually increasing.At the same time,the heat flow density of the chip is also increasing.If these heat are not discharged in time and effectively,the chip temperature will rise sharply,which will bring serious reliability problems to microelectronic chips.Therefore,how to effectively eliminate these heat is particularly important,which is of great significance to the electronic chip itself and its application development.Microchannel radiator is a liquid cooling heat dissipation method proposed for chip heat dissipation.Compared with the traditional air cooling heat dissipation method,it has small volume and ideal heat dissipation effect.It will not produce vibration,noise and other problems in the heat dissipation process,and the thermal conductivity of coolant is much higher than that of air.For chips with large heat flux density,it can meet the requirements of heat dissipation.In this paper,through the combination of multi physical field simulation and experiment,the microchannel radiator with single heat source and linear and broken structure is studied.Firstly,based on the theoretical knowledge of hydrodynamics and heat transfer,the microchannel simulation model is constructed,and the simulation analysis of microchannel radiator is carried out.The effects of coolant flow rate and channel cross-sectional area on the heat dissipation characteristics and hydraulic characteristics of microchannel radiator,the heat dissipation mechanism of spoiler structure to enhance heat dissipation,and the heat dissipation performance of a segmented microchannel structure are studied,The effects of coolant temperature and heat source location on heat dissipation and the comparative analysis of heat dissipation capacity of radiators with different microchannel structures.Then,based on the simulation research,two different import and export methods are designed for microchannel experimental samples with different sizes and structures.A set of replaceable experimental fixture is designed for different kinds of experimental samples.The fixture includes a base and a cover plate.The base is mainly used to place samples and connect water,and the cover plate is mainly used to fix samples and connect electricity.The size of the fixture is based on the sample.In the design process,the safety and reliability of the experiment are fully considered.The inlet and outlet are designed as decreasing type to prevent liquid blockage.The sealing ring structure is designed at the interface between the sample and the groove to prevent liquid leakage.The processed fixture can fully meet the required requirements and provide enough convenience and safety for the experimental process.Then,an experimental platform composed of water storage device,driving device,filtering device,microchannel heat dissipation,data measurement device and data acquisition device is built.Each device selects the experimental equipment with high reliability after in-depth investigation.The whole experimental system adopts an open-loop arrangement to avoid the impurities brought into the water storage device by the liquid after passing through the water pipe and equipment,which will block the experimental samples and ensure the reliability and stability of the experiment.Finally,the experimental study of microchannel radiator is carried out.When the sample is in a stable state,the pressure drop and temperature are measured and recorded by differential pressure transmitter and infrared thermal imager respectively.The results show that the faster the coolant flow rate will improve the damage ability to the fluid boundary layer,and then improve the heat dissipation capacity of the microchannel radiator,but will increase the pressure drop of the microchannel;Increasing the cross-sectional area of the channel will not improve the heat dissipation capacity,but will reduce the pressure drop of the channel;The size of the pressure drop is related to the size of the pipeline and has nothing to do with the distance between the pipelines;Due to the thin boundary layer at the inlet and the thick boundary layer at the outlet of microchannel radiator,there is inlet effect and heat accumulation;The heat dissipation effect of grooved microchannel structure is better than that of linear microchannel structure,but the pressure drop will rise;Compared with the broken line microchannel structure,the grooved microchannel structure has smaller temperature rise and better heat dissipation capacity under the condition of changing the heat source power.It is suitable for heat dissipation of high power density heat sources.Through the experimental verification,the accuracy of the simulation conclusions and laws is further proved,which can provide some guidance for the follow-up research of microchannel.