Design And Simulation Optimization Of IC Chip Peeling Device

Chip miniaturization is the development trend of the integrated circuit industry.Because the chip is made with brittle material,various damage phenomena such as chip fragmentation and scratches are easy to occur in the manufacturing process,which poses a new challenge to the chip peeling transfer.Aiming at the problem of easy damage in the process of chip peeling,the process of chip peeling and the device of chip peeling are mainly studied and analyzed in this thesis.The main research contents are discussed from the following three aspects:First of all,the chip peeling process is theoretically analyzed from the point of view of dynamics and statics,and the process parameters which mainly affect the chip peeling are obtained.A finite element simulation model is established to analyze and verify the above process parameters,analyze the influence of various process parameters on chip peeling.And the optimization direction of the chip peeling device is determined according to the analysis results.Second,in order to solve the problem that excessive speed is easy to damage the chip in the process of chip peeling,a new needle device with flexible buffer mechanism is designed,and a three-dimensional model of this new needle device is established.The dynamic simulation analyses of the picking process of the new and old needle device are carried out with Ansys software.The simulation results show that the new needle device has a good cushioning effect on the impact of the chip center.In addition,based on the new needle device,a new type of needle assembly device is designed,and its effectiveness is verified with the method of finite element analysis.At the end,based on the theoretical analysis results of the relevant process parameters of blue tape,two kinds of needle cover devices with adjustable blue tape adsorption area are proposed,and their three-dimensional models are established respectively.The effectiveness of the two needle cover devices is analyzed and verified with Fluent software.According to the advantages and disadvantages of the two needle cover devices’ structure,the spiral regulating valve needle cover is selected as the needle cover device of the final overall model.Based on the new needle device and the new needle cover device,the overall structure of the new chip peeling device is designed,and the three-dimensional model of the overall structure is established.Then,based on the structure’s 3D model,the virtual prototype of this new chip peeling device is setup and simulated with Adams software.The simulation results show that the overall structure of the new chip peeling device is reasonable and feasible,and this thesis provides a new idea for improving the success rate of chip peeling.