Study Of Multi-Band Microstrip Antenna And Package Performance

Wireless communication technology has been developing rapidly in our country and even in the world.It has become a new development direction to make wireless terminal equipment more faceted,smaller and more functional(multi band,multi polarization).Antenna is an important part of modern wireless communication system,so it has become one of the key research components.Based on this situation,the concept of encapsulated antenna(Ai P)is gradually proposed.It integrates the chip components,electronic components and antenna in the RF system to form a complete encapsulated antenna system.Packaging in this way not only improves the integration,but also achieves the purpose of miniaturization of RF system.Firstly,this paper expounds the research background of multi-band antenna and technology of encapsulated antenna,and then introduces the main antenna parameters,principles and methods.Next,based on the half mode theory of the antenna,combined with the requirements of antenna miniaturization and multi band,a multi-layer multi band encapsulated antenna is designed,which can be suitable for WLAN(2.4GHz and 5.8GHz)and Wi MAX band(3.5GHz).In addition,a single-layer multi band antenna which can work in three bands at the same time is designed by loading a U-shaped slot in the middle of the patch antenna through slotting technology.By modeling and simulating the two designed multi-band antennas,the simulation results show that the echo reflection coefficient is less than-10 d B and the directivity is good in their frequency range.At the same time,the influence of the thickness of the dielectric substrate on the performance of the single-layer multi band antenna is studied.In Chapter 4,the widely used 3D-MCM module is designed as the main part of the package,and the package is added below the vertical direction of the designed antenna to form the package antenna.After comparing the antenna package parameters with the antenna package parameters,the necessity of adding the through hole in the antenna package is analyzed,and the applicability of the two antenna package parameters is verified.The final designed multi-layer and multi band packaged antenna is less affected by the package under it,and can be used under the condition of high integration.