| In order to improve the communication capacity,the operating frequency band of the satellite payload has been continuously improved.The Q/V frequency band is an important frequency band for the Low-Orbit Satellite(LEO)Internet programming,which puts forward higher requirements for the antenna,including the characteristics of miniaturization,modularization and integration,to promote the integration of the antenna and the Radio Frequency(RF)front-end circuit.The Antenna-in-Package(Ai P)technology aims to integrate the antenna and the multi-function transceiver chip inside the package to achieve system-level functions,effectively solving the problems of miniaturization and multi-function in RF systems.In this thesis,under the concept of Ai P,the research on the quadrifilar helix antenna,array and package based on glass package is carried out,the main research is described as follows.Aiming at the problem that the quadrifilar helix antenna is not easy to be integrated inside the package,this thesis proposes a design scheme of a Q-band quadrifilar helix antenna based on the glass packaging process.The helix arm is constructed by using "dumbbell-shaped" patches and metallized via connections,which solves the problem that the quadrifilar helix antenna is difficult to integrate.The designed antenna has a wide beam characteristic of ±60deg and a 3d B axial ratio bandwidth more than 12%.Then,a compact double-layer broadband feeding network is designed for the antenna by means of vertical transition,which effectively widens the bandwidth of the antenna.In order to meet the existing process requirements and achieve better realizability,the antenna design is improved according to the quartz glass packaging process requirements,and the optimal design scheme of the vertical interconnection structure of the feeding network was analyzed.The simulation results show that the gain of the antenna is greater than 4.5d B in the range of 37.5GHz ～ 42.5GHz,and the antenna beamwidth is about ± 45 deg.According to the requirements of spaceborne platform for antenna gain and beam pointing,a 16-element rectangular grid array antenna is designed according to the designed antenna unit.The designed array antenna has a gain of more than 15 d B when it is not scanned,and the beam scan of ± 40 deg is perfored in the two-dimensional plane,and the gain roll off is less than 3d B when it is scanning to 40 deg.In order to ensure the independent work of the antenna and the RF chip,this paper designs a package cavity for the antenna to encapsulate the Integrate Circuit(IC)chip,and discusses its electromagnetic shielding performance.The package cavity adopts metal coating and metallized via array to enhance electromagnetic shielding,and uses vertical packaging to combine the antenna layer and the package layer,and analyzes the impact of some key parameters on the antenna performance.The simulation results show that,The addition of the package cavity has little influence on the performance of the antenna,and the antenna and the chip are well isolated.The proposed antenna integrates the package process and antenna performance,which is flexible and has certain engineering application value. |
PDF Full Text Request