Research On Microchannel Heat Dissipation And Temperature Monitoring Of Phased Array Antennas

With the rapid development of radar technology,phased array antennas have received increasing attention.In order to ensure the normal operation of phased array antennas in a proper temperature environment,heat dissipation is required.Water cooling is often preferred due to its superior heat dissipation efficiency.Water cooling systems typically rely on heat sinks to achieve heat dissipation,and the heat dissipation performance varies greatly depending on the design of the flow channel structure.This paper focuses on the thermal management of a specific phased array antenna and proposes the design of a microchannel heat sink based on its structure and heat dissipation requirements.The study investigates the heat sink structure,analyzes the factors affecting its heat dissipation performance,conducts experiments to evaluate the actual heat dissipation performance of the heat sink,and develops a temperature monitoring interface for real-time monitoring of the antenna’s temperature.The main research contents of this paper are as follows:(1)Introduction to the overall structure of phased array antennas,analysis of their thermal losses,and numerical simulation studies on the thermal characteristics of the phased array antenna without liquid cooling.When the power of a single heat source is10 W,the maximum temperature of the heat source can reach 352 °C,indicating the need for heat dissipation treatment.The study investigates a conventional rectangular flow channel microchannel heat sink and analyzes the factors affecting the heat transfer performance,providing a basis for the subsequent heat sink design.(2)Simplification of the phased array antenna model and design of a series-parallel microchannel heat sink structure based on the simplified model.The study first designs a hexagonal spider-web microchannel structure and investigates its heat transfer characteristics,with a maximum temperature of the heat source at 36.9 °C and a maximum temperature difference of 9.0 °C.Then,an improved design of a circular spider-web microchannel heat sink is proposed,with a maximum temperature of the heat source at 36.7 °C and a maximum temperature difference of 8.9 °C.Finally,a circular series-parallel microchannel heat sink is designed based on the circular spider-web structure,and its heat transfer characteristics are studied.The results show that the maximum temperature of the heat source is only 33.57 °C,with a maximum temperature difference of 4.9 °C.The heat transfer performance of the series-parallel structure significantly surpasses the previous two heat sink structures,making it the chosen microchannel structure for this paper.The study further investigates the influence of inlet flow velocity,coolant,heat sink material,and coolant flow direction on heat transfer performance under single-phase flow conditions.(3)To verify the accuracy of the numerical calculations,an experimental platform for microchannel liquid cooling is designed and established in this paper.The experiments are conducted using the controlled variable method to study the actual heat dissipation performance of the heat sink under different inlet flow velocities and heat source powers.The experimental data is organized and analyzed,and a comparison is made between the experimental and simulation results to validate the excellent heat transfer performance of the proposed heat sink structure.(4)Based on the working characteristics of the phased array antenna,a temperature monitoring software is designed to enable temperature monitoring of the device.The software includes three main modules: login management,real-time detection,and time period monitoring.It also provides threshold alarm functionality.