Research On High Performance Compact Power Divider Based On TSV

With the development of wireless communication technology,communication systems have increasingly high requirements for the integration and performance of microwave power splitters.Compared with other types of microwave power divider,Wilkinson power divider has a wider application range.In addition,with the development of Moore’s Law,more and more devices need to be integrated on chips,so the size of devices on chips must be developed towards the goal of miniaturization and high integration.However,Wilkinson power divider based on traditional technology has some problems,such as large size,difficult integration and increasingly unsatisfactory performance.In view of the above situation,in order to achieve the requirements of miniaturization and high performance of power splitters,research is conducted on single frequency and dual frequency power splitters with wider application frequency bands.The main work content is divided into the following three important parts,and the specific work is as follows:1.A high performance compact single-frequency power divider based on TSV is presented according to the theory of capacitive load loading and lumped parameter equivalence.The ideal circuit is simulated and optimized in ADS(Advanced Design System),and the threedimensional structure is modeled and simulated in HFSS(High Frequency Structure Simulator)software.Compared with other literature,the power divider proposed in this paper has a smaller size of 0.0022 λ2,return loss is-26dB,insertion loss is-3dB,isolation is-27dB.2.A high-performance compact dual frequency power divider based on TSV is proposed based on the theory of lumped parameter equivalence.The first dual frequency power divider designed based on the theory of lumped parameter equivalence is achieved by cascading two sections Π The low-pass circuit achieves impedance variation and ultimately operates in two frequency bands.Simulate and optimize the ideal circuit in ADS,and model and simulate the three-dimensional structure in HFSS software.Analyze the errors in the three-dimensional structure modeled by HFSS software,including coupling and parasitism.The result shows,the power splitter proposed in this paper has a return loss of-46dB,isolation of-41dB and insertion loss of-3.03dB at low frequency.At high frequencies,return loss is-42dB,isolation is-38dB,insertion loss is-3.039dB,size is only 0.03 × 0.01 λ02.3.A high-performance compact dual frequency power divider based on TSV is proposed based on frequency variation method.By using a series-parallel LC resonant circuit,the frequency of the circuit is adjusted,and a dual-frequency power divider can work in both low and high frequency bands.Among them,the duty-cycle ratio of the low-frequency band is about 20%,and that of the high-frequency band is about 26%.After simulating the S-parameter in ADS under ideal conditions,the whole model is built in HFSS software according to the schematic diagram.The inductance is achieved by TSV technology,and the capacitance is achieved by RDL technology.The results show that at low frequencies,the return loss can reach-35dB,the isolation can reach-3.011dB,and the insertion loss can reach-42.5dB.At high frequencies,the return loss can reach-32.5dB,the isolation can reach-3.016dB,and the insertion loss can reach-33dB.Dimension 0.009 × 0.0159λ02.