Low Profile Ka-Band T/R Modules And Phased Array Based On HTCC And Multi-Layer Mixed Pressing Process

With the development of electronic information technology,active phased array radar has become the mainstream of radar development due to its advantages in high maneuverability,anti-interference,multi target detection,and high fault tolerance.In order to reduce the weight and volume of radar,the miniaturization,lightweight,and low profile of active phased array radar has always been an important direction of its development.As important components of active phased array radar,the miniaturization and lightweight research of T/R modules and array antennas have always been the focus of active phased array radar research.The traditional T/R module adopts a brick structure,where the chip is mounted on a PCB and then placed inside a metal shell.This makes RF wiring more convenient,but increases the volume and cost of the T/R module.The proposal of microstrip antennas has reduced the profile of array antennas,but their narrowband characteristics have always been their inherent drawback.In response to the above issues,this article designs a miniaturized SIP type T/R module operating in the Ka frequency band using the HTCC process,and designs an array antenna operating in the Ka frequency band based on the multi-layer hybrid laminate process.The antenna and T/R components are interconnected through BGA ball planting.The specific work of this article is as follows:(1)In order to miniaturize the components,an HTCC process with 8 layers of media and9 layers of metal was used to produce a ceramic substrate,and the interconnection mode of chip pads directly connecting via holes was used to minimize the component size as much as possible,resulting in a 10.8mm ×10mm T/R component.(2)Due to the serious impedance mismatch caused by the interconnection mode of the chip pad directly connected via,the conventional branch matching structure has higher requirements for the process,so this paper proposes a complementary matching structure for the four layer ceramic dielectric stripline,which greatly reduces the process difficulty while ensuring the transmission performance,and can also achieve the matching effect without high-precision matching branches.(3)In order to achieve a low profile effect of the array antenna,this paper designs the array antenna based on a multi-layer hybrid technology.The multi-layer hybrid technology can add buried resistance internally and integrate the power divider into the antenna PCB,further improving integration and reducing interconnection distance.(4)In order to solve the narrowband problem of microstrip antennas,this article takes microstrip antennas as the prototype and expands bandwidth by adding radiation patches.At the same time,in order to meet directional adaptation,the antenna unit adopts a doubly fed circular polarization design,and in terms of array formation,a rotating feeding method is used to further optimize the antenna axis ratio.