The Modeling And Simulation Of The Temperature Field Of SMT During Reflow Soldering

Reflow soldering is a solder that connect SMD or SMC with PCB by meltingthe solder utilize external heat source make solder reflow and solidify the solder bycooling it (while adopting the soldering paste ).Reliable connection of variouscomponents is attainable when the temperature section of flow oven is setupsuitably.The traditional approach of experimentally analysing production defectswould be costly and virtually impossible for the temperature field model is not builthomeland inside .An alternative to this approach is to derive computational andnumerical models to simulate the reflow soldering process. This paper study the simulation of reflow soldering of the mailboard namedZC-845GLAB.Get the proper temperature figure of solder during the reflowsoldering process use the ANSYS software with the property of Pb63Sn37.Utilizeand spread the theory of calorifics ,building the heat model by changing the IRheating to convection heating,combining the actual physics environment of PCAs.Inorder to obtain the proper temperature fgure of soldering paste with the size of IRequipment ,the model is built including transfers speed of transfers cincture and thesetup of IR's temperature section. The geometry models of soldering paste,PCBboard, copper, big components and little components is built according to reserchobject ,and the temperature distribution of PCAs during the reflow soldering issimulated dynamicly and got with ANSYS software.Optimizing the design of IRoven's temperature section of to get the proper solder melting temperature figure.Themodel too is proved to be satisfied after comparing the actural temperature figurewith the theory temperature figure . The reflow soldering process of other products is also attained by input theparameters of geometry size and material property of the products with the ANSYSAPDL though the program in the paper is belong to ZC-854GLAB mailboard. The test use the infrared scan equipment prove the geometry and the materailparameters of PCAs is correct and the model tool is feasible,the reflow solderingprocess can be guided by the tool.