Strength Analysis And Optimization On The Moulds For Wallboard Profiles

Flat receptacle is one of the most important in producing the over-all aluminum wallboard profiles (wallboard or profile in short term). It is significant to study the strength analysis and improve the working condition of the flat receptacle. This literature mainly adopted both numerical simulation and physical simulation to analyze the stress distributing of the flat receptacle, and using optimization technology to optimize the structure. The main work of this literature is as follow:Firstly, the key technology of numerical simulation theory and stress equations is discussed to offer the technique support and theories to subsequent analysis (including 2D and 3D). Then, the planar and three-dimensional models of prestressed flat receptacle are built. Moreover, the numerical simulation for the flat receptacle is made by contact element and coupling method and the thermal-structure coupling is simulated by using the indirect ordinal approach. The flat receptacles under the conditions of pressure, prestress, thermal load and their coupling load are simulated respectively, and get the corresponding results and causes. Use the photoelastic experiment to prove the flexibility and the veracity of the results from the FEA.The model for structure optimization of the flat receptacle is built, and it is optimized by using the FEM. Adopting the suitable shape of the inner hole and the changeable shrinking range can alleviate the stress centralization caused by the especial shape of the inner hole.