Experimental Investigation On The Performance Of Devices For Heat Dispersing Of Chips And Enclosure

This paper designs and establishes the experimental setup to determine the performance in metal foam heat sink for chips cooling. Forced convection heat transfer of air in metal foam heat sink was investigated experimentally. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 10 PPI and 30 PPI. According to the problems in the practical application of chips, a standard method was established to test and evaluate the performance of metal foam heat sink. In this work, the effects of pore density (PPI) , air velocity and input power on the heat-transfer characteristics of metal foam heat sinks were studied. The steady state and transient processes of sudden jump heating and cooling were analysized.The results show that as air velocity increases, The average heat transfer coefficient increases and the thermal resistance reduces. The effect of input power is small on convection heat transfer capability. The thermal performance of 30PPI heat sink in the steady state and transient processes excelled 10PPI heat sink due to the fact that aluminum foam with a larger pore density has a larger heat-transfer area. However, due to larger pore sizes, the pressure drop encountered of 10PPI heat sink is much lower at a particular air velocity. As a result, for a given pressure drop, the heat transfer coefficient of 10PPI heat sink is higher compared to the 30 PPI heat sink. To compare with a conventional parallel-plate heat sink of the same size, the metal foam heat sink provides higher thermal performance.This paper also introduces the working principle of plate heat exchanger for keeping the temperature in enclosure normal. A testing system was established to test the characteristics of plate heat exchanger for enclosure, and it accords with the demand of flow capacity for the heat exchanger completely in real work, and tests the parameters accurately in every condition. A standard method was established to test and calculate the heat transfer and flow resistance characteristics of plate heat exchanger. The experimental results compare well with the computer simulation values that cooperated company computed.