Research On A Micro-wedg System And The Characteristic Of Discharging Location Fluctuating

With the development of science and technology, all walks of life puts forwardhigher and higher requirements for mechanical manufacturing products. Themanufacturing of micro parts has become one of the important research fields. Innumerous microfabrication techniques, micro Electrical Discharge Machining plays animportant role on account of its unique advantages. As an important branch of microElectrical Discharge Machining, Wire Electrical Discharge Grinding has been widelystudied and developed greatly in recent years. The fluctuation of the location where thedischarging occurs can lead the changing of discharging gap, which has a bad influenceon machining. As a consequence, it is of great significance to research the influence ofthe fluctuation of discharging location on the Wire Electrical Discharge Grinding.In this thesis，brief analysis of the system of Wire Electrical Discharge Grinding iscarried on and the structure of the discharging wheel designed. Based on this, the factorsthat may cause fluctuation of discharging location are analyzed as the basis for furtherresearch.Modal analysis is conducted and the simulation data shows the ability to resist thelow frequency interferences of the discharging module. The thesis also compares thepotential anti-vibration performances from the aspects of largest cornerite and smallestcornerite. The theoretical amplitude and frequency of discharging location is establishedby dynamics simulation, as well as the influence of wire parameters on the effect law offluctuation.On the experiment platform of the Wire Discharge Grinding, the discharginglocation was observed under the CCD device. The work of how different wireparameters, diameter changing of wire and structure of the discharging wheel influenceon the fluctuations of discharging location was researched, and the tension of the wirewas studied with a tension sensor. For further verification, experiments of WireElectrical Discharge Grinding are carried on to confirm the effect law of wireparameters on fluctuation of discharging location.