Precision CNC Vertical Milling Machine Double-sided Design And Development

Precision double-sided CNC grinder is a machining equipment for electronic device substrate and LCD glass, in great demand. The current domestic sided grinding machine is difficult to adjust the speed and has other defects, can’t meet the demands of some high-end products. These products are dependence on import. For these problems, a high-precision vertical sided grinding machine is designed in this paper.Firstly, the principle of double-sided grinding machine is studied. By analyzing the trajectory of the planet wheels, the conclusion is that the trajectory of the planet wheels is decided by the ratio of the outer ring and the inner ring gear. According to the conclusion, a new two-sided grinding machine design of mechanical systems have been proposed, including high-precision rotary mechanism tray, precision lifting ring structure and automatic lubrication systems.Secondly, according to performance requirements, the double-sided grinding machine CNC system is designed and developed. The CNC system overall block diagram is given. From the cost, efficiency, functionality integrated consider, touch screen, optimized inverter Selection configuration. Developed to facilitate the operation, monitoring and intuitive, user-friendly screens and touch-screen control panel, elaborated on the controller and HMI, controller and inverter-driven communications; proposed and implemented control system motor control programs and pneumatic control scheme, discussed the program of precision pneumatic control pressure closed loop function, shows the flow chart machine PLC design and develop the appropriate procedures.Finally, the test results meet the national standards and enterprise standards. The entire disk height difference of up to0.001mm, monolithic parallelism up to0.003mm. In operation, after a long-running case against a number of user surveys show that the development of high-precision CNC vertical milling machine double-sided, stable, safe and reliable, the sapphire substrate monolithic machining accuracy of less than0.005mm accuracy requirements. Testing and operation show that this double-sided grinding machine developed to achieve the ease of operation, speed adjustable to adapt to the sapphire substrate, silicon wafers, advanced ceramic substrate polishing process, low cost, high efficiency, high precision, to achieve the desired design requirements.