Research On The Automatic Control System Of LZP-9BC Of Double-Sided Polishing Machine

Due to super precision grinding and polishing equipment is silicon wafers to obtain super smooth, no damage on the surface of the main method, so the double sided polishing processing equipment developed by the study of ultra-precision processing field and optical electronic materials production and processing enterprise widespread concern and attention, and has achieved fruitful results.Influence polishing precision is one of the main factor is the polishing pressure, double-sided polishing electrical intelligent control system requires precise control of polishing pressure on the workpiece, thus ensuring the reliability of the wafer polishing quality.Is another factor affected the accuracy of polishing polishing liquid temperature control system, maintain the polishing liquid constant temperature state can make the machining surface to achieve the best effect.Based on double sided polishing intelligent mechanical and electrical gas system’s overall request, the control system’s overall function and the overall scheme design, the development has the interface of man-machine integration based on PLC control of double sided polishing machine intelligent control system, including hardware circuit design of PLC electrical control system software design and the main procedures are detailed described.In order to achieve high accuracy and high reliability of the system requirements, develop and design a polishing liquid temperature control and filter device, in the new development of ultra precision double-sided polishing machine polishing liquid temperature control function, has realized the chips of high efficiency, super smooth surface finish.