Coupled Thermal Failure Of The Cbga Experimental Study And Finite Element Analysis

Above all, the electronic packages and the current research state on its reliability were briefly introduced in this dissertation. Then, the thermal and mechanical failures of the solder joints in the EGA were researched by the experimental method and Finite Element Method (FEM).In this paper, the theory of the Moire Interferometry (MI) and Holographic Interferometry (HI) was systemically explained. Here, an integrative light path was put forward to full use of both methods, and a system was set up to deal with the experiment and its data automatically or half-automatically, which not only can save time but also has higher accuracy. By the experiments, we obtained the trait and regulation of specimen's deformation in room, high and low temperature environment.Based on data of experiments, the ANSYS5.3 software was used to simulate and compute the deformations of CBGA/PCB by 2-D PLANE42 model and 3-D SOLID model. By finite element simulation, the stresses and strains on the CBGA, PCB and solder joints were obtained, and the location and the value of the most stress were known.By the experiments and finite element simulation, the thermal and mechanical reliabilities of the solder joints in the BGA were fully analyzed in this paper. It provided credible dada for the design of the electronic packages, which was significant.