CAE Analysis Of Mobility Housing

With the rapid development of computer and electronic technology, the new electronic products are much smaller, more integrated and complex. The key to meet the requirements of development cycle and cost reduction is the wide application of CAE(Computer Aided Engineering). As one of the most important components of electronic products, the housing is generated from engineering plastic injection molding, its structure design not only affects the quality of injection molding process, but also the operational reliability of products. Thus, CAE technology can help optimize the structure design for researchers, according to predicting injection molding defects and structural weakness.This paper focuses on the mobility housing, which is created at Scanner and Mobility Department of Honeywell, the main work and research results are summarized as follows:(1) Based on the general design of mobility housing, typical injection molding structures are determined, including the channels, gates, molding frame, molding parts,molding temples and so on, combined with its complex structure characteristics and material’s physics properties and molding process.(2)From the method that Moldflow analysis CAE technology is taken advantage to simulate the filling time, pressure at the end of fill, weld lines, air distribution, temperature at flow front and warping deformation of mobility housing during injection molding process, we can know that: With no short shot and retention, the filling time can positively be accepted. Weld lines are small. There are fewer air traps existing in the border. The pressure at the end fill is balanced and symmetrical. The highest temperature at flow front is in the range of the usage temperature. The total deformation of the housing is not obvious and because of Y direction with larger size, its deformation is significantly higher than that in X and Z directions. According to the above analysis results, the optimizing opinion is proposed finally on the plastic products injection molding process.(3)After mobility housing is analyzed and optimized by Moldflow, combined with the reliability test requirements, the boundary condition and loading are discussed to establish three kinds of finite element analysis models about thermal deformation, drop impact and random vibration. On the aspect of thermal deformation, mobility housing’s strain and deformation in extreme temperatures are studied, then the maximum stress is far less than the allowable stress. In the drop impact, we research plastic products of the maximum strain during the instant impact, involving the bottom, side and front,and find the biggest stress on the side of three directions is still less than the yield strength. On the term of the random vibration, after seek inherent frequency and vibration type of mobility housing through modal analysis, realize that 3 Sigma response stress and deformation are both very little, affected by PSD of X and Y directions. Therefore, above three simulations verify the feasibility and reliability of mobility housing structure and provide a basis for further optimization design.(4)At the same time, the platform, which is based upon the Wheatstone bridge circuit, is built up to measure deformation on the representative positions. The comparison of test result and the simulated result is made, from which it can be seen that the error of the two result is small, the overall trend is consistent and the structure analysis model is qualitatively accurate.To sum up, with the strong acknowledge of engineering application, this paper has studied how to apply CAE technology to theoretically guide for structure optimization on the term of the injection molding and reliability test so as to provide the powerful support for the ideal process during the injection molding, positive guarantee for reliability test, and a basis for the further optimization of electronic products.