Research On The Spacing Adjustable Double-wire Wedm Used In Slice

Recently, underthe development of intelligent terminal, portable computers, mobile communication and military electronic technology, Requirements for micromachining are becoming urgent, and manufacture of high qualified thinner sustrate and packaging slice are the key technics in this field.Multi-wire(Wire saw) technology is popular in micromachining issue, and the slice workpiece, especially for hard and brittle ones, can acheive higher surface quality, thinner damaging layer and higher product ratio, through wire cutting technic which has the characteristic of non-contacting manufacture.However, the process with low machining effiency, warping deformation, which formed in cutting thin workpiece process, is a high challenge for its application in broader field.. Thus, our work mainly focus on reducing warping deformation, inhancing machining precision and efficiency.This paper observed the thin slice warping phenomenon through the single wire cutting experiments, then studied the effect of the pulse discharging energy, workpiece thickness and slice thickness on this phenomenon. Through analysing the energy and channel radius of pulse discharge, and heat source model, influence of two kinds of machining ways on the quality of thin slice was simulated based on single and double wire cutting method, moreover, the cloud distributions of temperature and internal stress field were compared within the two different methods and analysed in order to build up some connection between them and the wraping deformation of slice.Based on the previous research results, in order to adjust space between wires to change the thickness of slice, a set of double wire cutting slice thickness and processing equipment was disigned and equipped on normal EDM-machine.For single wire cutting of slice thickness less than 120 microns, serious warping deformation probably will occur, however, the results of single and double line thin slice processing experiments show that the system can control wraping deformation for those slice cutting below thickness of 120 microns.In order to solve the problem of cutting accuracy in multiple-wire EDM process,double wire cutting processing slice cutting model was established, and the effect of silk thread distance adjustment precision, speed, wire electrode tension, liquid on slice thickness error was analysed, correspondingly, slice error can be decreased to 5microns with manually adjust compensation.Finally, the comparing experiment on the efficiency of single and double wire cutting had been carried out. According to the results, double wire cutting efficiency can be improved, which is 79.8% higher than that in single wire, the latter experiments werecarried out to research how to inhance machining efficiency and the impact of peak current, pulse width, pulse interval etc on dicharging state, through collecting discharge wave and discarging state data.