Research On Stationarity Of Ultra-Precision Double-Sided Polishing Processing

The optoelectronic materials wafer such as silicon, sapphire etc. are processed efficiently with ultra-smooth surface for the demand of the rapid development of IC industry. The double-sided polishing processing is one of the main techniques of getting the ultra-smooth surface for these materials, and this technology has been paid attention by the ultra-precision machining research field and IC industry factory. The key factor to the quality of wafer surface is the stationarity of ultra-precision double-sided polishing processing.The processing of LZP-6BC double-sided polishing machine is studied. Modeling and simulation of double-sided polishing machine is achieved by using virtual prototype technology. Then processing craft parameters affect the stationarity of double-sided polishing processing is summarized by different experiments. And optimization processing craft parameters are used to guide develop polishing craft of optoelectronic materials wafer.The main work and results of this article are as follows:(1) Mechanism and processing craft of double-sided polishing is analyzed to support establishing a physical model of double-sided polishing, and then a virtual prototype model by using ADAMS is created to achieve pressure dynamic simulation.(2) Single factor method is applied for polishing experiments with optical glass. Different craft parameters, such as inside and outside gear speed ratio, polishing speed, polishing pressure, how to affect the stationarity of double-sided polishing processing are discussed.(3) Ultra-smooth and no traumatic surface has been got by polishing experiment with optimized craft parameters. Nano-processing is achieved.There are some theoretical simulations and experimental research about stationarity of ultra-precision double-sided polishing processing in this article. But double-sided chemical mechanical polishing covers lots of fields'knowledge. Studies double-sided chemical mechanical polishing can be combined with multiple disciplines'knowledge in future.