Study On Ultrasonic Machining Of Micro Array Holes In The Zirconia Ceramics Plate

Zirconia ceramics have been applied in the production of semiconductor due to their high temperature resistance,good wear resistance and good chemical stability.However,Zirconia ceramics are typically difficult materials to machine,and the traditional methods have low efficiency.Ultrasonic machining is an important method for the processing of hard and brittle materials because of its unique advantages.Aiming at the technical difficulties in the machining of array through-holes in the zirconia ceramic,the research of the ultrasonic machining of array through-holes based on the equivalent impedance is carried out.The detailed research contents are as follows:1.The ultrasonic vibration system is designed.We mainly worked on the design and test of piezoelectric transducer and horn of ultrasonic vibration system,and the performance test of resonance frequency and amplitude is carried out.The test results show that the resonant frequency of the ultrasonic vibration system meets the design requirements and the amplitude meets the requirements of the machining of array through-holes in the zirconia ceramic substrate.2.The human machine interface is designed.It mainly finished the tasks of human machine interface function demand,the way of hardware connection,integrated development environment,software structure and the way of communication.The human machine interface of the ultrasonic power and the touch screen interface of the machine tool meet the requirements of ultrasonic machining.3.The establishment and experiment of the ultrasonic experimental system is finished.The optimization of the control algorithm of the ultrasonic experimental system is completed.The difference between the real time impedance and the equivalent impedance threshold is added.The ratio of high and low level pulse number is introduced,and the ultrasonic power control button is added to the machine tool.4.The experiment of machining micro array holes in the Zirconia ceramics substrate is completed.A single factor experiment was designed to study the influence of ultrasonic power processing parameters,abrasive particle size and machine motion parameters on material removal rate,and we analyzed the reasons and complete micro array holes machining of in the Zirconia ceramics.