| In this report, the design and development of a manufacturing system based on hot embossing microfabrication technology is discussed. The hot embossing process capabilities are compared with existing microfabrication techniques. The design specifications of the developed hot embossing system are identified and defined as the process cycle time (heating and cooling), wafer size and applied load. The design methodology was initiated by the identifying the major subsystems (heating, cooling, forcing) followed by the subsystem level design. Solid modeling software and finite element analysis software were used during the modeling and analysis phases. The designed components were either fabricated or procured. Experiments were performed to verify theoretical analysis. The hot embossing microfabrication system was assembled and initial testing was performed. |
