Preparation And Properties Of Acrylamide Room Temperature Curing Epoxy Matrix Nano-composites

Comparing heat curing epoxy resin,room temperature curing epoxy resin which breaks through the restrictions of ambient temperature and has significantly advantages in energy consumption,greatly improves the applied range of epoxy resin.However,there are some defects after curing which is not satisfied the standard of practical application,such as relatively low curing density,low mechanical properties and poor thermal stability.In order to replace the pattern of heat curing epoxy resin,improving the resin curing process,optimizing resin products,and reducing energy consumption,these defects must be greatly improved.In this paper,acrylic acid(HAA)was respectively reacting to o-phenylenediamine(OPD),diaminotoluene(DAT)and trimethyl-m-phenylenediamine(TMP)appearing three new types of acrylamides.Contributing to these three acrylamides as curing agent and cerium oxide and silicon nano-powder as reinforcements,three pure epoxy system were produced,as well as six epoxy-based nanocomposite systems including OPD-HAA/Ce O₂,DAT-HAA/Ce O₂,TMP-HAA/Ce O₂,OPD-HAA/Si,DAT-HAA/Si,and TMP-HAA/Si.The curing behavior of resins and nanocomposites were studied by infrared spectroscopy(FTIR)and differential scanning calorimetry(DSC).Moreover the thermal stability Mechanical properties and fracture morphology of resin materials and composites were researched by TGA,universal tensile tester,impact tester,and SEM.The acrylamides mentioned above can cure epoxy resin at room temperature,and the thermal stability and mechanical properties of the cured products are better than those of aliphatic room temperature curing agents.The T₅ and T₁₀ of the three resin systems are around 150?and 230?,respectively,the bending strength is higher than30 MPa,and the tensile strength is higher than 38 MPa.Among them,TMP-HAA has the best performance,e.g.,12%of the carbon residual rate at 800?,71.1 MPa of the bending strength,58.2 MPa of the tensile strength,and 5%of the elongation at break.Due to the small size effect of CeO₂and Si nanoparticles and the effect of surface hydroxyl effect,the crosslink density of the resin was increased,and the surface effect of the nanoparticles enhanced the binding force between the particles and the resin,so that the particle-reinforced epoxy-based nanocomposite is prepared.According to the thermal performance test,the thermal stability of the composite material steadily improved with the increase of Ce O₂ and Si nano-powder content.When the addition amount was 35%(mass ratio),the system has the best thermal stability.Ce O₂nanoparticles increased the T₅,T₁₀,and Y_c of the three curing systems by 94?,117?,and 30.57%on average;Si nanoparticles increased the T₅,T₁₀,and Y_c of the three curing systems by 76?,102?,and 27.32%on average.According to the mechanical property test,the bending performance,tensile performance and impact resistance of the three curing systems were improved after adding Ce O₂ and Si nano powder.Specifically,when the cerium oxide nanometer is the reinforcement,the TMP-HAA/Ce O₂ system has the best mechanical properties with129.2 MPa of the bending strength,which is 81.7%higher than that of pure resin(E51/TMP-HAA),the impact resistance is 37.9 k J/m²,which is 58.5%higher than that of pure resin(E51/TMP-HAA),the tensile strength is 103.8 MPa,which is 78.3%higher than that of the pure resin(E51/TMP-HAA).In contrast,when the silicon nanometer become the reinforcement,the DAT-HAA/Si system has the best mechanical properties,the bending strength is 86.9 MPa,which is 188.7%higher than that of the pure resin(E51/DAT-HAA);the impact resistance is 99.5 k J/m²,which is71.8%higher than that of pure resin(E51/DAT-HAA);the tensile strength is 103 MPa,which is 106%higher than that of pure resin(E51/DAT-HAA).