Research On Grinding Process Of Metal Matrix Composites SiCp/Al

Silicon carbide particle reinforced aluminum matrix composite(SiCp/Al)is used as a combination of aluminum alloy and silicon carbide.Compared with traditional metals,it has higher specific strength,larger specific modulus and higher wear resistance.It has a series of advantages such as a small coefficient of thermal expansion and dimensional stability,and is already a preferred substitute for a variety of alloys such as ferroalloys.At present,composite materials have been widely used in high-tech fields such as aerospace and other industries,with rapid development,great prospects,and high surface quality requirements for materials in most applications.The processing of this material is more difficult than the simple metal or non-metal difficult-to-machine materials,the tool wear is severe,and the surface defects have been seriously processed.The material removal mechanism is also more complicated.The grinding theory of traditional metal and hard and brittle materials is not enough to explain the grinding mechanism of the composite.Therefore,it is necessary to continuously explore the material removal mechanism and grinding mechanism of metal matrix composites,and guide the selection of processing parameters from the theoretical aspect to achieve the high surface quality grinding of metal matrix composites.The main contents include:(1)By using ABAQUS finite element simulation software,a two-dimensional simulation model of single abrasive grinding process was established.The removal mechanism of Al and SiC materials of SiCp/Al composites was studied,the plastic removal conditions of SiC particles was studied.The material removal and surface defect formation mechanism of SiCp/Al composites under different parameter combinations were explored.(2)Through the single-grain grinding experiment,the material removal method of 20%and 55%SiCp/Al composites with single-grain grinding wheel was studied.The detection method was carried out to analyze the removal mode of the Al alloy matrix and the SiC particles.And the conditions for plastic removal of the SiC particles were also studied.The morphology of the collected grinding chips was observed and its composition was examined,and the formation mechanism of different forms of grinding chips was analyzed.(3)By using five-level single factor experiment and three-factor five-level orthogonal experiments,the surface quality of 20%and 55%SiCp/Al composites with electroplated grinding wheel and resin bond grinding wheel was compared respectively.By measuring the roughness value of the machined surface and observing the surface topography,the influence degree of the three grinding parameters on the surface quality is analyzed,and the order of the influence of each factor on the surface processing quality is studied,and the optimal process parameters were obtained by optimization.