Synthesis Of Inorganic Hybrid Fillers And Study The Electromagnetic Shielding And Thermal Conductivity Performance Of Their Composites

With the deepening of industrialization,traditional single materials can no longer meet the needs of social scientific and technological progress.Especially in the field of electronic packaging,researchers have conducted more in-depth research on the improvement of its performance.However,the material requirements for the new generation of electronic packages are more stringent,not only for heat dissipation,but also for magnetic shielding,mechanical and thermodynamic properties.Therefore,hybrid materials with better performance in electronic packaging materials should pay more attentions.This article focuses on the following three aspects of hybrid materials that can meet the requirements of electronic packaging:1.PEI,a general positive polyelectrolyte is used as a modifier due to it owns excellent adhesive properties and electrostatic adsorption with GO.The PEI is coated on the surface of GO,and then silver nanoparticles are grown on the surface of GO through redox to form a GO/PEI/Ag hybrid material,and GO/PEI/Ag is reduced to r GO/PEI/Ag by hydroiodic acid.The morphology and structure of the hybrid particles and performance of the r GO/PEI/Ag hybrid film were characterized by AFM,SEM,Zeta,FT-IR,XRD,TGA,XPS etc.Results show that:when the silver nanoparticle content is 8.62 wt%,the electrical conductivity of r GO/PEI/Ag composite films reach to 10515.51 S/m and the electromagnetic shielding effectiveness is 25 d B,thermal conductivity could up to 19.959Wm^-1K^-1.2.Instead of GO,in this chapter,the PEI was coated on the surface of CNT,and silver nanoparticles were grown on the surface of CNT by redox to prepare CNT/PEI/Ag composite film.The morphology and structure of the hybrid particles and performance of the CNT/PEI/Ag hybrid film were characterized by AFM,SEM,Zeta,FT-IR,XRD,TGA,XPS etc.Results show that:when the silver nanoparticle content is 14.4 wt%,the electrical conductivity of the CNT/PEI/Ag composite film is up to 37799.18 S/m,the electromagnetic shielding effectiveness is 34 d B,and the thermal conductivity is 35.932Wm^-1K^-1.This makes the composite film of great significance in the field of electronic packaging materials.3.Al₂O₃-PEI/epoxy composites were prepared by a relatively simple method,and the properties of the composites were studied systematically.The results show that the surface modification of PEI can improve the compatibility and dispersibitligy of Al₂O₃ in epoxy resin.When the content of PEI is only 0.04664 wt%,the maximum CTE 8.61 ppm/℃drop can be achieved;when the Al₂O₃-PEI content in the composites is 60.9 vol%,the thermal conductivity could reach to 2.057 Wm^-1K^-1,which is 11.2%higher than the thermal conductivity of Al₂O₃/epoxy composites and 570%higher than that of pure epoxy resin.We also using the Foygel model to fit the experimental results and calculated the contact thermal resistance.