Design And Research Of Disassembling Device For Back Cover Of Used Mobile Phone

There are a variety of precious metal materials in scrap mobile phone parts,and some components can be used for secondary use.Non-destructive disassembly and recycling is a necessary treatment method.The first task of disassembling a mobile phone is to disassemble the back cover of the mobile phone before completing the subsequent disassembly process.In order to solve the problem of dismantling the back cover of used mobile phones,a device for disassembling the back cover of used mobile phones is designed for mobile phone models with adhesive connection type and combined with the manual dismantling process.The main research contents are as follows:Use Solidworks to design the overall structure of the equipment and complete the selection of other working components.The main working process of the dismantling device for the back cover of the used mobile phone is to heat the back cover of the mobile phone,and then pull it through the suction cup to complete the disassembly.In-depth research and analysis of the heating process and the suction and pull process of the suction cup have realized the efficient disassembly of the back cover of the mobile phone.Using ANSYS Workbench to simulate and analyze the temperature field of the heating plate and the back cover of the mobile phone,the highest temperature of the heating plate is 90.098℃,the lowest temperature is 88.587℃,and the maximum temperature difference is about 1.51℃.The heating temperature of the back cover of the mobile phone is set to 90℃,which can meet the requirements of dismantling the back cover of the mobile phone.The bilinear cohesive zone model is used to simulate the adhesive layer of the back glue of the mobile phone,and the back glue material model adopts a crack-based energy release rate model for simulation analysis.Design the interactive orthogonal experiment of the mobile phone back cover pulling simulation,to determine the best parameter conditions of the vacuum suction cup: suction cup diameter 50 mm,vacuum pressure-70 KPa,suction cup suction position center and narrow side distance 25 mm,and long side distance 40 mm.Build the hardware circuit and design the software for the heating control system of the back cover of the mobile phone to ensure the stability of the heating process.Through the Simulink module of Matlab,the fuzzy adaptive PID control system is designed,analyzed and verified to realize the precise control of the heating temperature and achieve a better adhesive softening effect.Through image recognition technology,a mobile phone back cover disassembly detection system based on shape template matching is designed in the machine vision software Halcon,including the hardware and software parts of the detection system.The mobile phone back cover disassembly detection program was developed in the Visual Studio 2010 environment,which can easily and quickly detect the disassembly results.The design of the dismantling device for the back cover of the used mobile phone is an important part of the dismantling of the whole machine,which provides a strong basic guarantee for the dismantling line of the whole machine.