Simulation Analysis And Optimization Design Of Radiation-proof Robot Controller

Anti-nuclear radiation robot plays an important role in the treatment and improvement of nuclear accident emergency system.The severe characteristics of high radioactivity and high temperature in the nuclear environment pose a serious threat to life and safety.At present,remote control robot can only be used to complete the rescue and rescue tasks such as breaking down and removing obstacles.As the core component,the internal controller of the dismantling robot needs to solve the problem of radiation resistance as well as the sensitivity to temperature.Need to make sure that the controller in the actual application in the normal work and does not produce under transient overload caused by high temperature controller performance degradation or even damaged condition,in order to solve the problem of high temperature controller chip internal failure,in the light of the specific controller in the high temperature and high radiation conditions,radiation protection and thermal protection design of controller.A set of radiation and heat dissipation compatible structure model was designed and established.The heat dissipation characteristics of the model were analyzed by using Icepak thermal simulation software,and the structure was optimized later.Finally,by building a prototype and testing the temperature field inside the prototype,the correctness of the heat dissipation method and the rationality and feasibility of the designed heat dissipation structure are further verified.The specific research contents are as follows:Firstly,the basic theory of heat transfer is analyzed,and the preliminary scheme of structure design is determined according to the practical requirements;the feasibility of phase change heat storage and thermoelectric cooling module is analyzed :(1)by establishing mathematical model and simulation analysis of phase change materials,the change characteristics of paraffin wax phase change materials with temperature in the heat storage process are explored;(2)The model of TEC(semiconductor cooler)is established,the TEC is simulated and analyzed,and the relationship between the cooling temperature of TEC cooler and external factors is studied.Secondly,Ansys-Icepak thermal simulation analysis software is used to simulate the overall heat dissipation of the controller and the outer box.Through the simulation data,the heat dissipation data and the heat transfer characteristics of the outer box under two different temperatures are analyzed,and an optimization scheme is proposed for the equipment.Thirdly,the primary and secondary factors(fin height,fin number and fin thickness)that affect the fin cooling effect of the external chassis of the controller are determined based on orthogonal test.The optimal combination of the three factors is obtained through simulation analysis,and the geometry size of the fin is improved again.Finally,the correctness and reliability of the heat dissipation structure of the controller is verified by building a prototype platform and testing the internal heat source temperature and shell temperature of the controller.