Packages - Globe Thesis

Keyword [Packages] Result: 41 - 60 \| Page: 3 of 4
41.	Characterization and design of liquid crystal polymer (LCP) based multilayer RF components and packages
42.	Efficacy of rosemary and/or thyme oil as antilisterial ingredients in mozzarella type cheese or in cheese packages
43.	In-situ interfacial tensile strength measurements in microelectronic packages using a laser spallation technique
44.	Creep corrosion over plastic encapsulated microcircuit packages with noble metal pre-plated leadframes
45.	Thermo-mechanical behavior of tin-lead and lead-free ceramic column grid array packages
46.	A multi-scale method for the prediction of delamination in electronic packages
47.	Characterization of non-linear polymer properties to predict process induced warpage and residual stress of electronic packages
48.	Analysis of heat dissipation in electronic packages using CVD diamond substrate
49.	A combined experimental and analytical approach for interface fracture parameters between dissimilar materials in electronic packages
50.	Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages
51.	Biochemical, raw, and cooked color characteristics of individual bovine muscles in oxygen permeable and modified atmosphere packages
52.	Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders
53.	Package performance for liquid hazardous materials in high-altitude shipments
54.	Development of liquid crystalline polymer (LCP) surface mount packages for millimeter-wave applications
55.	Research and development of simulation and optimization technology for commercial nylon-6 manufacturing processes
56.	Improvement of interfacial adhesion in plastic packages: Dimples, metallic coatings and black oxide
57.	Shelf-life evaluation of ostrich meat
58.	Thermomechanical behavior of ball grid array solder joints under thermal and vibration loading: Testing and modeling
59.	Thermo-mechanical evaluation of interfacial integrity in multilayered microelectronic packages
60.	Thermomechanical properties of packaging materials and their applications to reliability evaluation for electronic packages
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