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Keyword [Packages]
Result: 61 - 72 | Page: 4 of 4
61.
Gallium arsenide die crack initiation in area array electronic packages
62.
Design of modified atmosphere packaging (MAP) systems: Modeling oxygen and carbon dioxide exchange within packages containing cut rutabagas
63.
Process-induced residual stresses analysis in plastic-encapsulated integrated circuit packages
64.
Integral resistors and capacitors for mixed-signal packages using electroless plating and polymer-ceramic nanocomposites
65.
Hexanal vapor to control decay of sliced apples in modified-atmosphere packages using metallocene film
66.
Mechanical and thermomechanical stability issues of 96.5SN-3.5AG solder joints in microelectronic packages
67.
Headspace gas analysis and fungal count in Parmesan cheese in various packages
68.
Warpage prediction of integrated circuits packages
69.
Steady state unwinding of yarn from cylindrical packages: Theory and experiment
70.
Evaluation of electronic packaging reliability using acoustic microscopy
71.
Fundamental investigation of induction sealing of paper/foil aseptic food packages
72.
Highly Sensitive in-Plane Strain Mapping Using a Laser Scanning Technique
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