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Keyword [Microstructure]
Result: 181 - 200 | Page: 10 of 10
181. Investigation Of Bulk Metallic Glass Composites Containing In Situ Formed Ductile Crystalline Precipitates
182. Study On Microstructures Of Hot Dip Aluminized Coatings And Effects Of La
183. Copper Family Nanomaterials: Shape-controlled Synthesis, Microstructure And Their Surface Properties
184. Microstructures And High Temperature Erosion Properties Of Supersonic Arc-sprayed Composite Coatings Of Cored Wires Containing Intermetallics And Nanosized Ceramics Under Nitrogen Protective Atmosphere
185. Simulation Of Using Process, Nano-improvement Of Corundum-Mullite Duplex Ceramic Kiln Furniture And Its Design And Preparation
186. Study On Olefin Polymerization Catalyzed By Zirconocene And Composite Support Ziegler-Natta Catalysts
187. Study On The Microstructure Of The Filter Cake And The Expression Filtration Theory
188. Optimization On Microstructures And Transport Properties Of Iron Disilicide Based Thermoelectrics Materials
189. Doping, Composite Of TiO2 Thin Films And Their Structure And Properties
190. Study On The Microstructure And Properties Of Cu-Cr-Zr Alloy After Deep Cryogenic Treatment
191. Study On Fabrication, Growth Mechanism And Microstructure Of K2Ti6O13 Whisker
192. Studies On The Grinding Behavior And Wear Resistance Of Y-TZP/Al2O3 Ceramics
193. Study On Solidification And Landfill Of Wastewater Sludge
194. Microstructure, Magnetic And Transport Properties Of Magnetic Nanogranular Films
195. The Research On Infiltration Casting Technology On Copper Substrate And The Properties Of The Infiltrated Layer
196. Investigation Of High Speed Steel Centrifugal Composite Casting Roll
197. Investigation Of Properties And Forming Mechanism Of Graded Structure Of Heavy Cross-sectional WC_p/Fe-C Composites
198. Effect Of Thermo-mechanical Processing On Microstructure And Mechanical Properties Of In Situ Ti Matrix Composites
199. Study On The Microstructure And Mechanical Properties Of Magnesium Alloy By Equal Channel Angular Extrusion
200. Microstructure And Properties Of SiCp/Cu Composites For Electronic Packaging
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