Flip-chip - Globe Thesis

Keyword [Flip-chip] Result: 1 - 20 \| Page: 1 of 9
1.	Study Of Improving Light-emitting Efficiency Of Thin-Film Flip-Chip LED By Nano-scale Structures
2.	Research On Algorithm Of Silicon Through Hole Matching And Flip Chip Routing For 3D Integrated Circuits
3.	Reliability Research On Electronic Packaging
4.	Study On The Simulation Of Interconnects In Microwave Multi-Chip Module
5.	Thermal-Mechanical And Hygroscopic Characteristics Of Micro-electronic Packaging Polymer And Its Packaging Reliability Study
6.	Research On The Packaging Technology For Integrated Power Electronics Module
7.	Studies On Vibration Propagation And Performance Formation Of Thermosonic Flip Chip Bonding Interface
8.	Microcosmic Mechanism And Rule Of The Interfaces In Ultrasonic Bonding
9.	Flip-chip And Related Issues
10.	The Practical Study Of Millimeter-wave Automotive Collision Avoidance Radar
11.	The Research On The Formation Mechanism Of Micro Aca Joints Resistance In The Flip Chip Bonding
12.	Effects Of Electromigration On Cross-solder Interaction And Interfacial Reaction In Lead-free Solder Joints
13.	Surface Tension-Powered Self-assembly Mechanism And Its Applications In Microelectronic Packaging
14.	Investigation Of Electromigration On Lead-Free Solder Bump In Flip Chip Packaging
15.	Dispensing System Design And Emulation For RFID Packaging
16.	Research On Alignment Methods And Optical Systems For Automatic Flip Chip Bonders
17.	Research On CMOS Intgrated Two-Dimensional Themal Wind Sensor
18.	Study Of Practically Advanced Assembly And Packaging Process Manufacturing Technologies Of MCM-C
19.	Research On MEMS Capacitive Pressure Sensors Based On Flip-Chip Technology
20.	Research On The Process And Reliability Of RFID Tag Packaged By ACA
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