Study On Synthesis And Properties Of Biphenyl-Content Epoxy Resin

Electronic materials are the basic of the microelectronic industry,as the mostly structural materials of integrated circuits——epoxy resinmolding compounds are developing fast along with the developmentof the technology of chips and the development of plastic packagingtechnology will deeply promote the development of themicroelectronic industry. Recently IC chips abroad are required moreand more integration, micromation and larger and the surface mounttechnology is developing. IC packaging requests the properties ofmaterial various, which can be concluded as "5" highness and "5"lows, namely high purity, high thermal resistance, high thermaloxidation stability, high mechanical property, high electrical insulationand high frequency stability, low dielectric constant and low dielectricloss, low moisture absorption, low internal stress, low thermalexpansion coefficient and low molding processing temperature. V中英文摘要Recently 80%-90%(almost the whole in Japan) of semiconductordevices abroad are using epoxy resin molding compounds replacingmetallic and ceramic molding compounds used in the past, and itsdeveloping foreground is very good. Epoxy resin is so important inmanufactures that there is a parlance "there is no epoxy resin, there isno IC". But the researching and the producing of plastic materials arevery weak. In the 90's import manufactures were monopolistic andexpensive. The research and exploitation of epoxy resin moldingcompounds at home have distinct disparities. As a result enhancing theexploitation of epoxy resin molding compounds to suit thedevelopment of electronic industry at home is very exigent.Researching and exploiting epoxy resin molding compounds with highproperties and using domestic packages to replace import products canbetter promote the developing of electronic industry at home. In this thesis based on Molecular Resign Principle, the rigidbiphenyl group had been successfully introduced into epoxy resinchains to prepare epoxy resin and curing agent with high thermalresistance. These materials have potential applications. In chapter Two, we have successfully synthesized four series ofepoxy resins with rigid biphenyl group through the biphenol withbiphenyl group and substitution biphenol. The results of FT-IR, NMR,DSC were agreed with supposed structure. The thermal property study VI中英文摘要of four series of epoxy resins shows that they are solid under roomtemperature. The thermal properties of epoxy resin with biphenylgroup have progressed, which is our purpose of the thesis design. In chapter three, comparing with the analysis of the thermalproperties of four series of epoxy resins, we chose the biphenol epoxyresin with tetra-methyl (TMBP), which has better application potential.The results of viscosity and solubility study show that TMBP has good,applied melt viscosity and solubility. In the thesis, we used the amidecuring agents DDM, DDS and BADK which was synthesized to studythe curing performance, and we fist studied the cure kinetics ofepoxy resin to sure the curing reaction condition. The results of thestudy shows that the sequence of the melt point of three curing agentsabove is DDS>BADK>DDM, on the contrary, the sequence of thereaction activation is DDM>BADK>DDS, which is relative withmolecular structure. The Reaction order of three curing reaction isapproximately the same, all complex reaction. Active hydrogen ofthree series of curing agents all reacted with the epoxy group of epoxyresin in the two sides of epoxy resin chains to make three dimensionsnetwork structure. Compared with two different methods, theactivation energy calculated by the Ozawa method is a little higherthan that calculated by the Kissinger method, but the regulations of thereaction action of three series of curing agents calculated with twomethods are the...