| This work presents the use of numerical modeling for the analysis of transient and steady state liquid jet impingement for cooling application of electronics, and energy dissipation during a CMP process under the influence of a series of parameters that controls the transport phenomena mechanism. Seven thorough studies were done to explore how the flow structure and conjugated heat transfer in both the solid and fluid regions was affected by adding a secondary rotational flow during the jet impingement process. Axis-symmetrical numerical models of round jets with a spinning or static nozzle were developed using the following configurations: confined, partially-confined, and free liquid jet impingement on a rotating or stationary uniformly heated disk of finite thickness and radius. Calculations were done for various materials, namely copper, silver, Constantan, and silicon with a solid to fluid thermal conductivity ratio covering a range of 36.91.2222, at different laminar Reynolds numbers ranging from 220 to 2,000, under a broad rotational rate range of 0 to 1,000 RPM (Ekman number=infinity--3.31x10--5), nozzle-to-plate spacing (beta=0.25.5.0), dimensionless disk thicknesses (b/dn=0.167.1.67), confinement ratio (rp/rd=0.2.0.75), and Prandtl number (1.29.124.44) using NH3, H2O, FC.77 and MIL.7808 as working fluids. An engineering correlation relating the average Nusselt number with the above parameters was developed for the prediction of system performance. The simulation results compared reasonably well with previous experimental studies.;The second major contribution of this research was the development of a three dimensional CMP model that shows the temperature distributions profile as an index of energy dissipation at the wafer and pad surfaces, and slurry interface. A finite element analysis was done with FIDAP 8.7.4 package under the influence of physical parameters, such as slurry flow rates (0.5.1.42 cc/s), polishing pressures (17.24.41.37 kPa), pad spinning rates (100.250 RPM), carrier spinning rates (15.75 RPM), and slurry film thicknesses (40.200 mum). Results in this study provide further insight of how the above parameters influence the thermal aspects of pad and wafer temperature and heat transfer coefficients distributions across the control volume under study. Numerical results support the interpretation of the experimental data. |
