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Study of the damage evolution function of tin silver copper in cycling

Posted on:2013-01-03Degree:Ph.DType:Dissertation
University:State University of New York at BinghamtonCandidate:Qasaimeh, AwniFull Text:PDF
GTID:1451390008476634Subject:Engineering
Abstract/Summary:
The present research focused on the assessment of solder joint fatigue life in microelectronics assemblies. A general concern of any reliability engineer is whether accelerated tests are relevant to field conditions. The risk of this was minimized by developing an approach to reduce the duration of an accelerated thermal cycling test, thus allowing for the use of less accelerated test conditions. For this purpose the conventional dye and pry technique was improved and used together with artificial neural networks to measure and characterize very early stages of crack growth.;The same work also demonstrated a quantitative link between thermal cycling induced recrystallization and a strong acceleration of the subsequent fatigue crack growth and failure. A new study was conducted in which different combinations of annealing and isothermal cycling provided a systematic characterization of the effects of a range of individual parameters on the recrystallization. Experiments showed the ongoing coarsening of secondary precipitates to have a clear effect on recrystallization. The rate of recrystallization was also shown not to scale with the inelastic energy deposition. This means that the most popular current thermal cycling model cannot apply to SnAgCu solder joints.;Recrystallization of the Sn grains is usually not the rate limiting mechanism in isothermal cycling. The crack initiation stage often takes up a much greater fraction of the overall life, and the eventual failure of BGA joints tends to involve transgranular crack growth instead. Cycling of individual solder joints allowed for monitoring of the evolution of the solder properties and the rate of inelastic energy deposition. Both the number of cycles to crack initiation and the subsequent number of cycles to failure were shown to be determined by the inelastic energy deposition. This provides for a simple model for the extrapolation of accelerated test results to the much milder cycling amplitudes characteristic of long term service conditions based on conventional Finite Element Modeling. It also offers a critical basis for the ongoing development of a practical model to account for the often dramatic break-down of Miner's rule of linear damage accumulation under variable cycling amplitudes as expected in realistic applications.
Keywords/Search Tags:Cycling, Inelastic energy deposition, Solder
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