| Microstructural features of single and multilayered strained (In xGa1−xAs/GaAs, (Al)GaAs1−ySb y/GaAs) and unstrained (In0.49Ga0.51P/GaAs) heteroepitaxial structures were evaluated. During growth of a 1.5% mismatched InxGa 1−xAs layer on GaAs at 470°C, real-time multibeam optical stress sensor measurements revealed an unexpected shoulder in the strain-thickness profile. Real-time data was used to pause film growth at pre-determined stress-states surrounding the shoulder region (pre-, mid- and post-shoulder) to probe its origin. Dislocation structure of each stress-state was characterized by transmission electron microscopy. The shoulder coincided with reactions between 60° dislocations forming edge dislocations, suggesting an increased dislocation mobility which is required for multiplication. Dislocation half-loops were observed via cross-sectional microscopy, resulting in rapid relaxation of the film. In-graded (InxGa1−xAs) and Sb-graded (Al0.5Ga0.5As1−ySby, GaAs 1−ySby) compositionally step-graded multilayer buffers were analyzed to determine the optimal alloy for preventing the propagation of threading dislocations to the epitaxial surface. Multilayers were graded from a lattice parameter of 0.564 nm to 0.591 nm (4.6% mismatch) over a 1 μm film thickness. Threading dislocation density in the top-most layer of the Sb-graded structures (≤109 cm−2) was lower than the In-graded alloy (>1010 cm−2). In the InxGa1−xAs structure, threading dislocations were observed to congregate in discrete channels directly correlated to surface crosshatches. As/Sb compositional modulations in the Sb-graded structures reveal a more planar growth surface, preventing threading dislocation trapping. Characterization of dislocation structure indicated a directional asymmetry in the 60° and edge dislocation density for the GaAs1−ySb y multilayer. Replacing Ga with Al0.5Ga0.5 in the Sb-graded ternary improved planarity, resulting in a more uniform dislocation density. Residual strain (calculated from quantitative x-ray analysis and dislocation density) in each of the buffer layers was within the bounds predicted by existing relaxation models and dependent upon lattice mismatch strain. Lattice-matched In0.49Ga0.51P-GaAs junctions as active regions of a heterojuction bipolar transistor were evaluated by high-resolution transmission electron microscopy and related to device performance. Microscopy was established as a feasible technique for characterizing interfacial roughness which was related to interface crystal quality (quantified by reverse-biased leakage currents) but not low-voltage device performance. |
